IP Library Granted Patent US 6,963,212
Granted Patent B2
US 6,963,212 · App. 10/807,630 · Granted Nov 8, 2005

Self-testing input/output pad

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Quick Facts
Patent No.
US 6,963,212
App. No.
10/807,630
Granted
Nov 8, 2005
Kind
B2
Abstract

The present invention teaches an apparatus for testing the circuitry in an input/output (I/O) pad without probing the contact site on the I/O pad. A dominant driving circuit has an output coupled to a first contact site on a semiconductor chip. A subordinate driving circuit also has an output coupled to the first contact site on the semiconductor chip. A test control circuit sets a drive fight up between the dominant and subordinate driving circuits, the test control circuit selecting a stronger drive strength for the dominant driving circuit than for the subordinate driving circuit. The drive fight produces a test value at the first contact site. The test value from the first contact site is transferred to a second contact site on the semiconductor chip to be probed by an external prober.

Claims (37)

1. An apparatus, comprising:

a semiconductor chip;

a first contact site on the semiconductor chip;

a dominant driving circuit having a first input and a first output coupled to the first contact site, the first output having a variable drive strength responsive to the first input;

a subordinate driving circuit having a second input and a second output coupled to the first contact site, the second output having a variable drive strength responsive to the second input;

a test control circuit having a test mode, at least one output coupled to the first input of the first driving circuit, and at least one output coupled to the second input of the second driving circuit,

the test control circuit operable in test mode to create a drive fight between the dominant and subordinate driving circuits, and to generate a test value at the first contact site;

a second contact site on the semiconductor chip for probing; and

a gated signal path connecting the second contact site to the first contact site, operable in test mode to transfer the test value from the first contact site to the second contact site.

2. An apparatus as in claim 1 , wherein the test control circuit is operable in the test mode to select a greater output drive strength for the dominant driving circuit than for the subordinate driving circuit, and generate a test value at the first contact site that is indicative of the functionality of the dominant driving circuit.

3. An apparatus as in claim 2 , wherein the dominant driving circuit includes

a first parallel circuit having a plurality of branches connected in parallel between the first contact site and a first node, at least one branch of the first parallel circuit including at least one transistor.

4. An apparatus as in claim 3 , wherein each branch of the first parallel circuit includes a transistor.

5. An apparatus as in claim 4 , wherein the test control circuit is operable in the test mode to enable a number of transistors required in the dominant driving circuit to overdrive the subordinate driving circuit.

6. An apparatus as in claim 5 , wherein the signal path includes

a shift register for capturing the test value from the first contact site and shifting it to the second contact site.

7. An apparatus as in claim 6 , wherein the shift register includes at least one boundary scan cell.

8. An apparatus as in claim 5 , wherein the first node is for connection to a power source.

9. An apparatus as in claim 5 , wherein the first node is for connection to a ground.

10. An apparatus as in claim 5 , wherein the subordinate driving circuit includes

a second parallel circuit having a plurality of branches connected in parallel between the first contact site and a second node, at least one branch of the second parallel circuit including at least one transistor.

11. An apparatus as in claim 10 , wherein each branch of the second parallel circuit includes a transistor.

12. An apparatus as in claim 2 , wherein the test control circuit includes a plurality of scan flip-flops linked together to form a scan shift register, at least one scan flip-flop having an output coupled to an input of the dominant driving circuit.

13. A method for testing an input/output (I/O) pad on a semiconductor chip, comprising:

selecting a first drive strength for a first driving circuit;

selecting a second drive strength for a second driving circuit, the first drive strength greater than the second drive strength;

driving a first contact site of the I/O pad with both the first and second driving circuits;

generating a test value at the first contact site indicative of the drive strength of the first driving circuit; and

transferring the test value to a second contact site on a second I/O pad.

14. A method as in claim 13 , further comprising:

probing the second contact site with an external prober to determine the test value.

15. A method as in claim 13 , wherein transferring the test value includes:

shifting the test value through a boundary shift register.

16. A method as in claim 14 , wherein selecting a first drive strength includes:

enabling a branch in a parallel circuit in the first driving circuit.

17. A method as in claim 15 , wherein selecting a second drive strength includes:

enabling a branch in a parallel circuit in the second driving circuit.

Assignments (13)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 017207 FRAME 0020. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2013
From: CITICORP NORTH AMERICA, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030420/0048 →
SECURITY AGREEMENT Recorded Feb 24, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: CITICORP NORTH AMERICA, INC.
Reel/Frame 017207/0882 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017207/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2004
From: BROWN, CHARLES ALLEN
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 014861/0116 →