Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
View Patent ↗Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a planarizing pad and moving the substrate assembly across the planarizing surface through a planarizing zone. The method also includes replacing at least a portion of a used volume of planarizing solution on the planarizing surface with fresh planarizing solution during the planarization cycle of a single substrate assembly. The used planarizing solution can be replaced with fresh planarizing solution by actively removing the used planarizing solution from the pad with a removing unit and depositing fresh planarizing solution onto the pad in the planarizing zone. The used planarizing solution, for example, can be removed either while the substrate assembly is moved through the planarizing zone, or between planarizing stages of a multi-stage planarizing process. In another aspect of the invention, a planarizing machine for planarizing microelectronic-device substrate assemblies includes removing unit at the accumulation zone to actively remove used planarizing solution from the accumulation zone on the stationary planarizing pad.
1. A method of planarizing a microelectronic-device substrate assembly, comprising:
removing material from a substrate assembly by pressing the substrate assembly against a planarizing surface of a planarizing pad and moving the substrate assembly across the planarizing surface; and
replacing at least a portion of a used volume of planarizing solution on the planarizing surface with fresh planarizing solution by actively removing used planarizing solution from an accumulation zone on the planarizing surface adjacent to a planarizing zone on the planarizing surface with a removing unit other than solely the movement of the pad and depositing fresh planarizing solution onto the planarizing pad, wherein actively removing the used planarizing solution comprises wiping at least a portion of the used planarizing fluid from the planarizing pad while the substrate assembly is pressed against and moved across the planarizing surface.
2. The method of claim 1 wherein removing material from the substrate assembly and replacing at least a portion of the used volume of planarizing solution occur contemporaneously to continuously planarize the substrate assembly.
3. The method of claim 2 wherein the planarizing pad has a plurality of holes in an accumulation zone, the holes extending through the planarizing pad from the planarizing surface, and the removing unit comprises a vacuum chamber operatively coupled to the holes, and wherein actively removing the used planarizing solution comprises sucking the used planarizing solution through the holes in the planarizing pad by drawing a vacuum in the vacuum chamber while the substrate is pressed against and moved across the planarizing surface.