IP Library › Granted Patent US 7,275,316
Granted Patent B2
US 7,275,316 · App. 10/815,464 · Granted Oct 2, 2007

Method of embedding passive component within via

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Quick Facts
Patent No.
US 7,275,316
App. No.
10/815,464
Granted
Oct 2, 2007
Kind
B2
Abstract

A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Claims (26)

1. A method comprising:

forming a via in a substrate;

removing a portion of the via in the substrate to form a first via portion and a second via portion; and

forming an electrical component in the via in the substrate, wherein removing a portion of the via in the substrate to form a first via portion and a second via portion further includes:

masking a portion of the via; and

etching an unmasked portion of the via.

2. The method of claim 1 wherein forming an electrical component in the via includes forming at least a portion of a resistor.

3. The method of claim 1 wherein forming an electrical component in the via includes forming at least a portion of a capacitor.

4. The method of claim 1 wherein forming an electrical component in the via includes forming at least a portion of a core.

5. The method of claim 1 wherein forming an electrical component in the via includes forming a resistor.

6. The method of claim 1 wherein forming an electrical component in the via includes forming a core.

7. The method of claim 1 wherein forming an electrical component in the via includes forming a memory.

8. The method of claim 1 wherein the electrical component in the via includes a passive electrical component.

9. The method of claim 1 wherein the electrical component in the via is a passive electrical component.

10. The method of claim 1 wherein the electrical component includes a capacitor further comprising:

an inner cylindrical portion; and

an outer via portion substantially surrounding the inner cylindrical portion.

11. The method of claim 1 wherein the electrical component includes a capacitor further comprising:

a first curved portion; and

a second curved portion spaced from the first curved portion, wherein the distance between the first curved portion and the second curved portion vary.

12. The method of claim 1 wherein the electrical component includes a capacitor further comprising:

a first curved portion; and

a second curved portion spaced from the first curved portion, wherein the first curved portion and the second curved portion are portions of a via formed by insulating a first portion of a via from a second portion of a via.

13. The method of claim 1 wherein forming an electrical component in the via further includes:

forming a first electrical component from the first via portion; and

forming a second electrical component from the second via portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →