IP Library Granted Patent US 7,529,947
Granted Patent B2
US 7,529,947 · App. 10/815,567 · Granted May 5, 2009

Determining power consumption of an application

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Quick Facts
Patent No.
US 7,529,947
App. No.
10/815,567
Granted
May 5, 2009
Kind
B2
Abstract

In one embodiment, a method is provided. The method of this embodiment provides monitoring one or more sensor outputs of a sensor, the sensor to measure a power consumption property of the chip, and each sensor output to indicate a measurement of the power consumption property; and recording a time that each of the one or more sensor outputs indicates an existence of the power consumption property at the measurement corresponding to each of the one or more sensor outputs.

Claims (45)

1. A method comprising:

monitoring one or more sensor outputs, each of the one or more sensor outputs measuring a power consumption property of a chip; and

recording a total time that each of the one or more sensor outputs indicates an existence of the power consumption property at a corresponding predetermined value.

2. The method of claim 1 , wherein the power consumption property of the chip comprises temperature, and the temperature comprises a temperature range including one or more temperatures.

3. The method of claim 2 , wherein each sensor output corresponds to a corresponding temperature range, and indicates an existence of a temperature of the chip falling within the corresponding temperature range as measured at the corresponding sensor output.

4. The method of claim 1 , wherein the power consumption property of the chip comprises voltage drop, and the voltage drop comprises a voltage drop range including one or more voltage drops.

5. The method of claim 4 , wherein each sensor output corresponds to a corresponding voltage drop range, and each sensor output indicates an existence of a voltage drop falling within the corresponding voltage drop range as measured at the corresponding sensor output.

6. A method for analyzing operation of a chip executing an application, the method comprising:

monitoring one or more parts of the application;

obtaining event data from a sensor attached to the chip, the event data including one or more times that one or more sensor outputs of the sensor indicates an existence of a power consumption property of the chip being at least a corresponding predetermined value as measured at the one or more sensor outputs; and

for a first art of the one or more parts of the application being monitored, correlating the event data with one or more instruction addresses associated with the first part of the application.

7. The method of claim 6 , wherein the power consumption property comprises temperature.

8. The method of claim 6 , wherein the power consumption property comprises voltage drop.

9. An apparatus for analyzing operation of a chip executing an application, the apparatus comprising:

circuitry capable of:

monitoring one or more parts of the application;

obtaining event data from a sensor attached to the chip, the event data including one or more times that one or more sensor outputs of the sensor indicates an existence of a power consumption property of the chip being at least a corresponding predetermined value as measured at the one or more senor outputs; and

for a first part of the one or more parts of the application being monitored, correlating the event data with one or more instruction addresses associated with the first part of the application.

10. The apparatus of claim 9 , wherein the power consumption property of the chip comprises temperature, and the temperature comprises a temperature range including one or more temperatures.

11. The apparatus of claim 10 , wherein each sensor output corresponds to a corresponding temperature range, and indicates an existence of a temperature of the chip falling within the corresponding temperature range as measured at the corresponding sensor output.

12. The apparatus of claim 9 , wherein the power consumption property of the chip comprises voltage drop, and the voltage drop comprises a voltage drop range including one or more voltage drops.

13. The apparatus of claim 12 , wherein each sensor output corresponds to a corresponding voltage drop range, and each sensor output indicates an existence of a voltage drop falling within the corresponding voltage drop range as measured at the corresponding sensor output.

14. A system for analyzing operation of a chip executing an application, the system comprising:

circuitry on a first node, the circuitry connected to the chip and capable of:

monitoring one or more parts of the application;

obtaining event data from a sensor attached to the chip, the event data including one or more times that each of one or more sensor outputs of the sensor indicates an existence of a power consumption property of the chip being at least a corresponding predetermined value as measured at the one or more sensor outputs; and

for a first part of the one or more parts of the application, correlating the event data with one or more instruction addresses associated with the first part of the application; and

a performance analyzer on a second node, the performance analyzer communicatively coupled to the circuitry on the first node, the performance analyzer to use the correlated information.

15. The system of claim 14 , wherein the power consumption property of the chip comprises temperature, and the temperature comprises a temperature range including one or more temperatures.

16. The system of claim 15 , wherein each sensor output corresponds to a temperature range, and indicates an existence of a temperature of the chip falling within the corresponding temperature range as measured at the corresponding sensor output.

17. The system of claim 14 , wherein the power consumption property of the chip comprises voltage drop, and the voltage drop comprises a voltage drop range including one or more voltage drops.

18. The system of claim 17 , wherein each sensor output corresponds to a voltage drop range, and each sensor output indicates an existence of a voltage drop falling within the corresponding voltage drop range as measured at the corresponding sensor output.

19. A memory storing machine-accessible instructions, the instructions when executed by a machine, cause the machine to:

monitor one or more parts of the instructions;

obtain event data from a sensor attached to the machine, the event data including one or more times that each of one or more sensor outputs indicates an existence of a power consumption property of a chip being at least a predetermined value; and

correlate the event data with the one or more parts of the instructions being monitored.

20. The memory of claim 19 , wherein the power consumption property of the chip comprises a temperature range, and wherein the temperature range includes one or more temperatures.

21. The memory of claim 20 , wherein each sensor output corresponds to a corresponding temperature range, and indicates an existence of a temperature of the machine falling within the corresponding temperature range as measured at the corresponding sensor output.

22. The memory of claim 19 , wherein the power consumption property of the chip comprises voltage drop, and wherein the voltage drop comprises a voltage drop range including one or more voltage drops.

23. The memory of claim 22 , wherein each sensor output corresponds to a voltage drop range, and each sensor output indicates an existence of a voltage drop falling within the corresponding voltage drop range as measured at the corresponding sensor output.

24. A method for analyzing operation of a chip based on an executing application, the method comprising:

monitoring one or more portions of the executing application;

obtaining one or more instruction addresses corresponding to the one or more portions;

correlating the monitored one or more portions of the executing application corresponding to the one or more instruction addresses obtained with power consumption data obtained by a sensor on the chip; and

storing data corresponding to the correlating.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2020
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE, LTD.
Reel/Frame 053475/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2020
From: MARVELL INTERNATIONAL LTD.
To: CAVIUM INTERNATIONAL
Reel/Frame 052918/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2006
From: INTEL CORPORATION
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 018515/0817 →