Process chamber component having electroplated yttrium containing coating
A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating is resistant to corrosion in the plasma, and can have a compositional gradient of yttrium-containing species through a thickness of the coating. In one embodiment, the coating is formed by electroplating a layer comprising yttrium onto the surface, and then electroplating a second layer onto the first layer, and annealing the first and second layers. The second layer can comprise aluminum or zirconium. In another embodiment, the coating is formed by electroplating a layer comprising a mixture of aluminum and yttrium onto the surface and annealing the layer.
1. A substrate processing chamber component capable of being exposed to a plasma in a process chamber, the component comprising:
(a) a substrate processing chamber component structure composed of metal; and
(b) an electroplated coating on the substrate processing chamber component structure, the electroplated coating comprising an interface having a thickness with a gradually changing concentration of yttrium-containing species therethrough.
2. A component according to claim 1 wherein the yttrium-containing species comprises one or more of elemental yttrium and yttrium oxide.
3. A component according to claim 1 wherein the yttrium-containing species comprises yttrium oxide, and wherein the electroplated coating further comprises aluminum oxide or zirconium oxide.
4. A component according to claim 3 wherein the electroplated coating comprises a compound comprising yttrium oxide and aluminum oxide.
5. A component according to claim 3 wherein the electroplated coating comprises partially stabilized zirconium oxide.
6. A component according to claim 1 wherein the electroplated coating comprises a thickness having a gradually changing concentration of the aluminum-containing species therethrough.
7. A component according to claim 1 wherein the electroplated coating is fabricated by annealing a first electroplated layer comprising aluminum or zirconium, and a second electroplated layer comprising yttrium.
8. A component according to claim 7 comprising annealing the layers to form oxidized species.
9. A component according to claim 1 wherein the electroplated coating is fabricated by electroplating a layer comprising a mixture of (i) yttrium and (ii) aluminum or zirconium onto the surface, and annealing the layer.
10. A component according to claim 1 wherein the electroplated coating is formed by:
(i) immersing the surface of the component structure in an electroplating bath comprising a solution of yttrium species;
(ii) connecting the component structure to a negative terminal of a voltage source; and
(iii) connecting an anode immersed in the bath to a positive terminal of the voltage source, the anode comprising an inert material or material to be electroplated.
11. A component according to claim 1 wherein the metal comprises an alloy.
12. A substrate processing chamber comprising:
(a) a wall around a process zone;
(b) a substrate support in the process zone;
(c) a ring about the substrate;
(d) a gas distributor;
(e) a gas energizer; and
(f) a gas exhaust port,
wherein at least one of the wall, substrate support, ring, or gas distributor, comprises a component capable of being exposed to a plasma in a process chamber the component comprising a structure composed of metal, and having an electroplated coating comprising an interface having a thickness with a gradually changing concentration of yttrium-containing species therethrough, and
whereby a substrate transported into the process chamber can be processed by a gas released by the gas distributor, energized by the gas energizer, and exhausted by from the gas exhaust port.
13. A chamber according to claim 12 wherein the yttrium-containing species comprises one or more of elemental yttrium and yttrium oxide.
14. A chamber according to claim 12 wherein the yttrium-containing species comprises yttrium oxide, and wherein the electroplated coating further comprises aluminum oxide or zirconium oxide.
15. A chamber according to claim 12 wherein the electroplated coating comprises a compound comprising yttrium oxide and aluminum oxide.
16. A chamber according to claim 12 wherein the electroplated coating comprises partially stabilized zirconium oxide.
17. A chamber according to claim 12 wherein the electroplated coating comprises a thickness having a gradually changing concentration of the aluminum-containing species therethrough.
18. A chamber according to claim 12 wherein the electroplated coating is formed by:
(i) immersing the surface of the component structure in an electroplating bath comprising a solution of yttrium species;
(ii) connecting the component structure to a negative terminal of a voltage source; and
(iii) connecting an anode immersed in the bath to a positive terminal of the voltage source, the anode comprising an inert material or the material to be electroplated.
19. A chamber according to claim 12 wherein the metal comprises an aluminum alloy.
20. A substrate processing chamber component capable of being exposed to a plasma in a process chamber, the component comprising:
(a) a substrate processing chamber component structure; and
(b) an electroplated coating on the substrate processing chamber component structure, the electroplated coating comprising yttrium-containing species and partially stabilized zirconium oxide, and the electroplated coating comprising a thickness having a gradually changing concentration of yttrium-containing species therethrough.
21. A component according to claim 20 wherein the yttrium-containing species comprises one or more of elemental yttrium and yttrium oxide.
22. A component according to claim 20 wherein the yttrium-containing species comprises yttrium oxide, and wherein the electroplated coating further comprises aluminum oxide.
23. A component according to claim 20 wherein the electroplated coating comprises a compound comprising yttrium oxide and aluminum oxide.
24. A chamber according to claim 20 wherein the electroplated coating comprises a thickness having a gradually changing concentration of the aluminum-containing species therethrough.
25. A component according to claim 20 comprising a chamber wall, substrate support, ring, or gas distributor, of a process chamber.
26. A substrate processing chamber component capable of being exposed to a plasma in a process chamber, the component comprising:
(a) a substrate processing chamber component structure; and
(b) an electroplated coating on the substrate processing chamber component structure, the electroplated coating comprising (i) yttrium-containing species, (ii) aluminum-containing species comprising at least one of elemental aluminum or aluminum oxide, and (iii) zirconium-containing species comprising at least one of elemental zirconium or zirconium oxide.
27. A component according to claim 26 wherein the component structure comprises a metal.
28. A component according to claim 26 wherein the electroplated coating comprising a thickness having a gradually changing concentration of yttrium-containing species therethrough.
29. A substrate processing chamber comprising:
(a) a wall around a process zone;
(b) a substrate support in the process zone;
(c) a ring about the substrate;
(d) a gas distributor;
(e) a gas energizer; and
(f) a gas exhaust port,
wherein at least one of the wall, substrate support, ring, or gas distributor, comprises a component capable of being exposed to a plasma in a process chamber, the component comprising a structure having an electroplated coating comprising yttrium-containing species and partially stabilized zirconium oxide, and the electroplated coating comprising a thickness having a gradually changing concentration of yttrium-containing species therethrough.
30. A chamber according to claim 29 wherein the component structure comprises a metal.