IP Library › Patent Application 10827606
Patent Application
App. No. 10/827,606

Plasma sprayed indium tin oxide target for sputtering

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Quick Facts
Patent No.
US None
App. No.
10/827,606
Abstract

A method for forming a target for sputtering is provided. The method includes providing a metal target backing. A surface of the provided metal target backing is metalized. A sputtering donor material is plasma sprayed on the metalized metal target backing.

Claims (31)

1 . A method for forming a target for sputtering, the method comprising:

providing a metal target backing,

depositing a metallic coating on the metallic onto the metal target backing; and

plasma spraying a sputtering donor material onto the metallic coating.

2 . The method of claim 1 , wherein the metal target backing has been degreased.

3 . The method of claim 2 , further comprising the step of blasting of the degreased metal target backing with a grit.

4 . The method of claim 3 , wherein the grit is aluminum oxide.

5 . The method of claim 1 , wherein the metal target backing comprises a planar sheet.

6 . The method of claim 1 , wherein the metal target backing comprises a cylindrical pipe.

7 . The method of claim 1 , wherein the step of depositing comprises thermal spraying a molten metal onto the surface of the metal target backing.

8 . The method of claim 1 , wherein the step of depositing comprises arc wire spraying a molten metal onto the surface of the metal target backing.

9 . The method of claim 1 , wherein the metallic coating comprises nickel chrome.

10 . The method of claim 1 wherein the metallic coating comprises molybolium.

11 . The method of claim 1 , wherein the metallic coating comprises aluminum.

12 . The method of claim 1 , wherein the metallic coating comprises aluminum silicon.

13 . The method of claim 1 , wherein the sputtering donor material is indium tin oxide.

14 . A target for sputtering comprising:

a metal target backing,

a metalizing coating deposited onto the metal target backing; and

a sputtering source material deposited onto the metalizing coating.

15 . The target of claim 14 , wherein the metal target backing is a planar sheet.

16 . The target of claim 14 , wherein the metal target backing is a cylindrical pipe.

17 . The target of claim 14 , wherein the metal target backing is copper.

18 . The target of claim 14 , wherein the metal target backing is aluminum.

19 . The target of claim 14 , wherein the metalizing coating is a molten metal thermal sprayed onto the surface of the metal target backing.

20 . The target of claim 14 , wherein the metalizing coating is a molten metal arc wire sprayed onto the surface of the metal target backing.

21 . The target of claim 14 , wherein the metalizing coating is Nickel Chrome.

22 . The target of claim 14 , wherein the metalizing coating is Molybolium.

23 . The target of claim 14 , wherein the metalizing coating is Aluminum.

24 . The target of claim 14 , wherein the metalizing coating is Aluminum Silicon.

25 . The target of claim 12 , wherein the sputtering source material is Indium Tin Oxide.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded May 1, 2011
From: COMERICA BANK
To: NXEDGE, INC. OF BOISE
Reel/Frame 026205/0756 →
SECURITY INTEREST Recorded Sep 30, 2004
From: NXEDGE INC. OF BOISE, A DELAWARE CORPORATION
To: COMERICA BANK
Reel/Frame 015945/0175 →