Multilayer ceramic electronic component and mounting structure and method for the same
A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.
1. A mounting structure for a multilayer ceramic electronic component, comprising:
a substrate having electrodes provided thereon; and
a multilayer ceramic electronic component having external electrodes and a thermoplastic resin layer provided thereon, the external electrodes being soldered to the electrodes of the substrate, the thermoplastic resin layer covering substantially the entire surface except for a soldered portion of the multilayer ceramic electronic component and a portion of the solder.
2. A mounting structure according to claim 1 , wherein said thermoplastic resin layer includes a copolymer having one main chain unit selected from the group consisting of monofluoroethylene, difluoroethylene, trifluoroethylene, and tetrafluoroethylene.
3. A mounting structure according to claim 1 , wherein said thermoplastic resin layer has a thickness of about 1.0 to about 50 μm.
4. A mounting structure according to claim 1 , wherein said multilayer ceramic electronic component includes a capacitor element including a base composite.
5. A mounting structure according to claim 4 , wherein said base composite includes a plurality of ceramic layers and internal electrodes which are electrically connected to said external electrodes.
6. A mounting structure according to claim 1 , wherein said external electrodes are disposed on end surfaces of said multilayer ceramic electronic component.
7. A mounting structure according to claim 1 , wherein said external electrodes including a conductive paste containing one of silver and copper.
8. A method for mounting a multilayer ceramic electronic component on a substrate, comprising the steps of:
covering an entire surface of a multilayer ceramic electronic component with a thermoplastic resin layer; and
soldering external electrodes of the multilayer ceramic electronic component to electrodes of a substrate, the thermoplastic resin layer being molten due to heat required for soldering, the molten solder excluding the molten thermoplastic resin layer from the vicinity of the external electrodes.
9. The method according to claim 8 , wherein said thermoplastic resin layer includes a copolymer having one main chain unit selected from the group consisting of monofluoroethylene, difluoroethylene, trifluoroethylene, and tetrafluoroethylene.
10. The method according to claim 8 , wherein in said covering step, said thermoplastic resin layer is applied to a thickness of about 1.0 to about 50 μm.
11. A multilayer ceramic electronic component comprising:
an electronic element including a ceramic base composite and external electrodes; and
a thermoplastic resin layer covering substantially an entire surface of the electronic element, the thermoplastic resin layer including a copolymer having one main chain unit selected from the group consisting of monofluoroethylene, difluoroethylene, trifluoroethylene, and tetrafluoroethylene.
12. The multilayer ceramic electronic component according to claim 11 , wherein the thermoplastic resin layer has a thickness of about 1.0 to about 50 μm.
13. The multilayer ceramic electronic component according to claim 11 , wherein said electronic element includes a capacitor element.
14. The multilayer ceramic electronic component according to claim 13 , wherein said ceramic base composite includes a plurality of ceramic layers and internal electrodes which are electrically connected to said external electrodes.
15. The multilayer ceramic electronic component according to claim 11 , wherein said external electrodes are disposed on end surfaces of said electronic element.
16. The multilayer ceramic electronic component according to claim 11 , wherein said external electrodes include a conductive paste containing one of silver and copper.