Method for manufacturing a plate-shaped workpiece
View Patent ↗A method for producing a disk shaped workpiece with a dielectric substrate includes treatment in a plasma process volume between two electrode faces bounding a high-frequency plasma discharge. One electrode face is of dielectric material and is at a high-frequency potential with a varying distribution along the face. The other electrode face is metallic. Reactive gas is introduced into the process volume through an aperture pattern. The dielectric substrate, before treatment, is at least regionally coated with a layer material to whose specific resistance applies: 10 −5 Ωcm≦ ≦10 −1 Ωcm, and to the resulting surface resistance R S of the layer applies: 0<R S ≦10 4 Ω. Subsequently, the coated substrate is positioned on the metallic electrode face and is etched or coated reactively under plasma enhancement in the plasma process volume.
1. A method for manufacturing a plate-shaped workpiece comprising:
providing a vacuum recipient with two mutually facing electrode surfaces, one of said electrode surfaces being of a dielectric material, the other of said electrode surfaces being of a metal;
providing a substrate of dielectric material having opposed surfaces and comprising along one of said opposed surfaces a coating of a material having a specific resistance ρ for which there is valid:
10 −5 Ωcm≦ρ≦10 −1 Ωcm
said coating being so that the resulting surface resistance R S of said coating is:
0≦R S ≦10 4 Ω □ ;
depositing said coated substrate on said other electrode surface;
establishing between said electrode surfaces an electric Rf field;
inletting into said vacuum recipient through a multitude of openings in said one electrode surface, a reactive gas;
establishing a locally varying electrical Rf potential along said one electrode surface;
thereby etching or coating said substrate.
2. The method of claim 1 , wherein establishing said locally varying electrical Rf potential as well as said inletting comprise providing said one electrode surface by a surface facing towards said other electrode surface of a two-dimensionally extended arrangement of dielectric material and providing between a surface of said arrangement opposed to said one electrode surface and a coupling surface of a metal, a chamber and performing at least one of the following steps:
selecting the mutual distance of said surface of said arrangement opposed and said coupling surface locally varying along said coupling surface;
selecting thickness of said arrangement varying along said coupling surface;
selecting the dielectric constant of the material of said arrangement varying considered along said coupling surface and further;
inletting said reactive gas into said chamber through said openings through said arrangement into said vacuum recipient; and
applying an Rf signal between said coupling surface and said other of said electrode surfaces.
3. The method of claim 2 , comprising providing said arrangement of dielectric material with a substantially constant thickness considered along said coupling surface.
4. The method of claim 2 , comprising providing said arrangement of dielectric material with a thickness which locally varies considered along said coupling surface.
5. The method of claim 2 , wherein said electric Rf potential in the center of said one electrode surface is established to be different from the electric potential applied along the periphery of said one electrode surface.
6. The method of claim 2 , further comprising at least one of the following steps:
selecting a distance between said opposed surface of said arrangement and said coupling surface to be smaller along the periphery of said one electrode surface than in the center of said one electrode surface;
selecting the thickness of said arrangement of dielectric material along the periphery of said one electrode surface to be smaller than in the center of said one electrode surface;
selecting the dielectric constant of material of said arrangement along the periphery of said one electrode surface to be larger than in the center of said one electrode surface.
7. The method of claim 6 , comprising one of the following steps:
a) providing said coupling surface substantially flat and said arrangement of dielectric material at least substantially of a constant thickness and, considered from said other electrode surface, convexly bent;
b) providing said arrangement of dielectric material of substantially constant thickness and flat and said coupling surface, considered from said other electrode surface, concavely bent;
c) providing said coupling surface, considered from said other electrode surface, to be concavely bent and said arrangement to have a substantially flat opposed surface, said one electrode surface being, considered from said other electrode surface, concavely bent;
d) providing said coupling surface and said opposed surface of said arrangement substantially flat and mutually parallel and said one electrode surface, considered from the other electrode surface, convexly bent;
e) providing said coupling and said one electrode surface substantially flat and said opposed surface of said arrangement, considered from said other electrode surface, convexly bent.
8. The method of claim 2 , said arrangement comprising tiles of dielectric material.
9. The method of claim 8 , said tiles being of a ceramic material.
10. The method of claim 2 , wherein at least one prevails:
the distance of said opposed surface of said arrangement from said coupling surface is established to vary in at least one step, the thickness of said arrangement is established to vary in at least one step.
11. The method of claim 2 , wherein at least one prevails:
said distance of said opposed surface of said arrangement from said coupling surface is established to steadily vary, the thickness of said arrangement is established to steadily vary.
12. The method of claim 1 , wherein said coating of said substrate comprises an electrically conductive oxide.
13. The method of claim 12 , wherein said oxide is transparent.
14. The method of claim 1 , wherein said coating of said substrate comprises at least one of the following materials: ZnO, InO 2 , SnO 2 , all doped or undoped.
15. The method of claim 1 , wherein the thickness Ds of said coating is selected as follows:
10 nm≦Ds≦5 μm.
16. The method of claim 1 , further comprising inletting said reactive gas comprising inletting at least one of the following gases: NH 3 , N 2 , SF 6 , CF 4 , Cl 2 , O 2 , F 2 , CH 4 , Silane, Disilane, H 2 , Phosphine, Diborane, Trimethylborane, NF 3 .
17. The method of claim 1 , including establishing said Rf electric field at a frequency f Rf for which there is valid:
10 MHz≦f Rf ≦500 MHz.
18. The method of claim 17 , wherein said frequency is selected to be:
13 MHz≦f Rf ≦70 MHz.
19. The method of claim 1 , wherein the diameter of said substrate is at least 0.5 m.
20. The method of claim 2 , wherein said chamber is filled with a solid dielectric material.
21. The method of claim 20 , wherein the dielectric constant of said solid dielectric material varies along said one electrode surface.
22. The method of claim 21 , wherein said solid dielectric material is equal to the dielectric material of said one electrode surface.