Semiconductor device and power supply system
A power MOS-FET is used as a high side switch transistor for a non-insulated DC/DC converter. An electrode section that serves as a source terminal of the power MOS-FET is connected to one outer lead and two outer leads via bonding wires respectively. The outer lead is an external terminal connected to a path for driving the gate. Each of the outer leads is an external terminal connected to a main current path. Owing to the connection of the main current path and the gate driving path in discrete form, the influence of parasitic inductance can be reduced and voltage conversion efficiency can be improved.
1. A semiconductor device, comprising:
a first power transistor used as a high side switch;
a first external connecting terminal; and
a second external connecting terminal,
wherein the first power transistor is formed on a semiconductor chip,
wherein a source terminal of the first power transistor is coupled to the first external connecting terminal and to the second external connecting terminal respectively, and
wherein the first external connecting terminal and the second external connecting terminal are respectively formed so as to be separated from each other and coupled to the source terminal by different respective coupling paths.
2. A semiconductor device according to claim 1 , wherein the first external connecting terminal is coupled to the source terminal through a plate-shaped metal plate, and
wherein the second external connecting terminal is coupled to the source terminal though a plate-shaped metal plate.
3. A semiconductor device according to claim 1 , further comprising:
a second power transistor used as a low side switch.
4. A semiconductor device, comprising:
a first power transistor used as a high side switch;
a second power transistor used as a low side switch;
a driver which drives the first and second power transistors; and
a first external connecting terminal coupled to a drain of the second power transistor,
wherein the first power transistor is formed on a first semiconductor chip, the second power transistor is formed on a second semiconductor chip, and the driver is formed on a third semiconductor chip;
wherein a source terminal of the first power transistor is coupled to the first external connecting terminal and to a source-grounded terminal provided in the driver, by different coupling paths respectively,
wherein the driver has a first drive unit for driving the first power transistor and a second drive unit for driving the second power transistor, and
wherein the source-grounded terminal is used as a low side power supply terminal of the first drive unit.
5. A semiconductor device according to claim 4 , wherein the source terminal of the first power transistor is coupled to the drain of the second power transistor through a plate-shaped metal plate,
wherein the source terminal of the first power transistor is coupled to the source-grounded terminal through a plate-shaped metal plate, and
wherein the drain of the second power transistor is coupled to the first external connecting terminal through a plate-shaped metal plate.
6. A semiconductor device, comprising:
a first power transistor used as a high side switch;
a second power transistor used as a low side switch;
a first external connecting terminal coupled to a drain of the second power transistor; and
a driver controller comprising a driver which drives the first and second power transistors, and a controller which generates a control signal for driving and controlling the driver,
wherein the first power transistor is formed on a first semiconductor chip, the second power transistor is formed on a second semiconductor chip, and the driver controller is formed on a third semiconductor chip,
wherein a source terminal of the first power transistor is coupled to the first external connecting terminal and to a source-grounded terminal provided in the driver controller, by different coupling paths respectively,
wherein the driver controller has a first drive unit for driving the first power transistor and a second drive unit for driving the second power transistor, and
wherein the source-grounded terminal is used as a low side power supply terminal of the first drive unit.
7. A semiconductor device according to claim 6 , wherein the source terminal of the first power transistor is coupled to the drain of the second power transistor through a plate-shaped metal plate,
wherein the source terminal of the first power transistor is coupled to the source-grounded terminal through a plate-shaped metal plate, and
wherein the drain of the second power transistor is coupled to the first external connecting terminal through a plate-shaped metal plate.
8. A power supply system, comprising:
a semiconductor device which has a first power transistor used as a high side switch, a first external connecting terminal, and a second external connecting terminal;
a driver which drives the first power transistor;
a smoothing coil; and
a printed wiring board on which the first power transistor, the driver and the coil are packaged,
wherein a source terminal of the first power transistor is coupled to the first external connecting terminal and to the second external connecting terminal respectively, and the first and second external connecting terminals are formed so as to be separated from each other and coupled to the source terminal by different respective coupling paths,
wherein the printed wiring board has a first wiring through which the first external connecting terminal of the first power transistor is coupled to the driver, and a second wiring through which the second external connecting terminal of the first power transistor and a connecting portion of the coil are coupled, and
wherein the first wiring and the second wiring are formed in different coupling paths respectively.
9. A power supply system, comprising:
a power module comprising a first power transistor used as a high side switch, a second power transistor used as a low side switch, a first external connecting terminal coupled to a drain of the second power transistor, and a driver driving the first and the second power transistors;
a smoothing coil; and
a printed wiring board on which the power module and the coil are packaged,
wherein the first power transistor is formed on a first semiconductor chip, the second power transistor is formed on a second semiconductor chip, and the driver is formed on a third semiconductor chip,
wherein a source terminal of the first power transistor is coupled to the first external connecting terminal, and to a source-grounded terminal provided in the driver, by different coupling paths respectively,
wherein the printed wiring board has a first wiring between the first external connecting terminal and a connecting portion of the coil,
wherein the driver has a first drive unit for driving the first power transistor and a second drive unit for driving the second power transistor, and
wherein the source-grounded terminal is used as a low side power supply terminal of the first drive unit.
10. A semiconductor device suitable for use in a power supply system, comprising:
a power transistor including a control electrode, a first source electrode connected to an external terminal and a second source electrode, said power transistor being used as a high side switch of the power supply system; and
a driver which is connected to the control electrode of the power transistor and to the second source electrode, and which outputs a control voltage for controlling the power transistor between the control electrode and the second source electrode,
wherein the second source electrode is used as a low side power supply terminal for driving the control terminal of the power transistor.
11. A semiconductor device according to claim 10 , wherein the power transistor and the driver are formed in discrete semiconductor chips.