Method of manufacturing gallium nitride-based single crystal substrate
View Patent ↗Disclosed herein is a method of manufacturing a gallium nitride-based (Al x In y Ga (1−x−y) N, where 0≦x≦1, 0≦y≦1, 0≦x+y≦1) single crystal substrate. The method comprises the steps of preparing a ZnO substrate, primarily growing a gallium nitride-based single crystal layer, and secondarily growing an additional gallium nitride-based single crystal layer on the primarily grown gallium nitride-based single crystal layer while removing the ZnO substrate by etching the underside of the ZnO substrate.
1. A method of manufacturing a gallium nitride-based single crystal substrate, comprising:
a) preparing a zinc oxide (ZnO) substrate;
b) primarily growing a gallium nitride-based (Al x In y Ga (1−x−y) N, where 0≦x≦1, 0≦y≦1, 0≦x+y≦1) single crystal layer on the ZnO substrate at a temperature of about 500° C. to 600° C.; and
c) secondarily growing an additional gallium nitride-based single crystal layer on the primarily grown gallium nitride-based single crystal layer at a temperature of 900° C.˜1,150° C., while removing the ZnO substrate by etching the underside of the ZnO substrate,
wherein the ZnO substrate has a thickness of about 150 μm or less and the primarily grown gallium nitride-based single crystal has a thickness of about 50 μm˜150 μm.
2. The method as set forth in claim 1 , wherein the gallium nitride-based single crystal layer is grown using an HVPE (Hydride Vapor Phase Epitaxy) process.
3. The method as set forth in claim 1 , wherein the step c) comprises the step of secondarily growing an additional gallium nitride-based single crystal layer on the primarily grown gallium nitride-based single crystal layer while chemically etching the underside of the ZnO substrate using HCl gas.
4. The method as set forth in claim 1 , wherein the step b) and/or the step c) comprises the step of growing an n-type gallium nitride-based single crystal layer with additionally supplying SiH 4 gas.
5. The method as set forth in claim 3 , further comprising: d) lapping the underside of the gallium nitride-based single crystal, from which the ZnO substrate is removed, thereby removing the underside by a predetermined thickness, after the step c).
6. The method as set forth in claim 5 , wherein the underside of the gallium nitride-based single crystal is removed by a thickness approximately the same as the thickness of the primarily grown gallium nitride single crystal layer.
7. The method as set forth in claim 5 , further comprising: e) polishing the lapped underside of the gallium nitride-based single crystal.
8. A method of manufacturing a gallium nitride-based single crystal substrate, comprising:
a) preparing a zinc oxide (ZnO) substrate;
b) primarily growing a gallium nitride-based (Al x In y Ga (1−x−y) N, where 0≦x≦1, 0≦y≦1, 0≦x+y≦1) single crystal layer on the ZnO substrate at a temperature of about 500 C to 600° C.; and
c) secondarily growing an additional gallium nitride-based single crystal layer on the primarily grown gallium nitride-based single crystal layer at a temperature of 900° C.˜1,150° C., while removing the ZnO substrate by etching the underside of the ZnO substrate.