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App. No. 10/838,639 · Confirmation No. 3960

Chip scale package with flip chip interconnect

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2006-08-23 ABN Abandonment 2 View
2006-02-23 XT/ Extension of Time 3 View
2005-08-23 CTNF Non-Final Rejection 8 View
2005-08-23 1449 List of References cited by applicant and considered by examiner 3 View
2005-08-23 892 List of references cited by examiner 1 View
2005-08-23 FWCLM Index of Claims 1 View
2005-08-09 CTRS Requirement for Restriction/Election 8 View
2005-08-09 1449 List of References cited by applicant and considered by examiner 3 View
2005-08-09 892 List of references cited by examiner 1 View
2005-08-09 FWCLM Index of Claims 1 View
2005-08-09 SRFW Search information including classification, databases and other search related notes 1 View
2005-06-30 ELC. Response to Election / Restriction Filed 1 View
2005-06-30 SPEC Specification 1 View
2005-06-30 CLM Claims 2 View
2005-06-30 REM Applicant Arguments/Remarks Made in an Amendment 2 View
2005-06-30 WFEE Fee Worksheet (SB06) 1 View
2005-06-01 CTRS Requirement for Restriction/Election 5 View
2005-06-01 FWCLM Index of Claims 1 View
2004-07-19 PEFR Applicant Response to Pre-Exam Formalities Notice 4 View
2004-07-19 136A Authorization for Extension of Time all replies 4 View
2004-07-09 PEFN Pre-Exam Formalities Notice 2 View
2004-06-15 IDS Information Disclosure Statement (IDS) Form (SB08) 7 View
2004-05-04 TRNA Transmittal of New Application 1 View
2004-05-04 SPEC Specification 8 View
2004-05-04 CLM Claims 3 View
2004-05-04 ABST Abstract 1 View
2004-05-04 DRW Drawings-only black and white line drawings 1 View
2004-05-04 OATH Oath or Declaration filed 7 View
2004-05-04 ADS Application Data Sheet 5 View
2004-05-04 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/838,639
Filed
2004-05-04
Pub. No.
US20040222440A1
Art Unit
2814