Patent Application
Provisional
App. No. 60/272,237
· Confirmation No. 6922
Chip scale package with flip chip interconnect
Provisional Application Expired
Inventors
Rajendra D. Pendse
Fremont, CA
Nazir Ahmad
San Jose, CA
Andrea Chen
San Jose, CA
Kyung M. Kim
Kyoung Ki-do, KOREA, REPUBLIC OF
Young Do Kweon
Cupertino, CA
Samuel Tam
Daly City, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- 60084/300800
- Confirmation No.
- 6922
Child
Claims priority from a provisional application
→
App. 11/361,028
Filed 2006-02-23
· Abandoned -- Incomplete Application (Pre-examination)
Child
Claims priority from a provisional application
→
App. 10/838,639
Filed 2004-05-04
· Abandoned -- Failure to Respond to an Office Action
Child
Claims priority from a provisional application
→
App. 10/081,491
· US 6,737,295
Filed 2002-02-22
· Patented Case
Child
PCT
Claims priority from a provisional application
→
PCT/US2002/005691
Filed 2002-02-25
· PCT - IPER (International Preliminary Examination Report) 409-416 Mailed
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/272,237
- Filed
- 2001-02-27
External Links