Optical surface mount technology package
View Patent ↗A semiconductor package includes a package substrate, an optical device die atop the package substrate, a transparent optical element atop the die, an optional dam around the die, and an encapsulant entirely covering the die and partially covering the transparent optical element.
1. A semiconductor package comprising:
a package substrate;
a die atop the package substrate, the die comprising an optical device;
a transparent optical element atop the die;
a dam surrounding the die; and
an encapsulant within the dam, wherein the encapsulant entirely covers the die and partially covers the transparent optical element.
2. The package of claim 1 , wherein the transparent optical element is selected from the group consisting of a filter and a lens.
3. The package of claim 2 , wherein the lens is selected from the group consisting of a rectangular lens and a spherical lens.
4. The package of claim 1 , wherein the dam comprises a thixotropic epoxy.
5. The package of claim 1 , wherein the dam is rectangular with rounded corners.
6. The package of claim 1 , wherein the optical device is selected from the group consisting of a laser, a light emitting diode, and a photodiode.
7. The package of claim 6 , further comprising another die located inside the dam and covered by the encapsulant, said another die comprising a circuit driving the optical device.
8. A semiconductor package comprising:
a package substrate;
a die atop the package substrate, the die comprising an optical device;
a transparent optical element atop the die;
an encapsulant entirely covering the die and partially covering the transparent optical element;
wherein the package substrate is selected from the group consisting of a printed circuit board and a ceramic substrate.
9. A semiconductor package comprising:
a package substrate comprising a ball grid array on a bottom surface;
a die atop the package substrate, the die comprising an optical device;
a transparent optical element atop the die; and
an encapsulant entirely covering the die and partially covering the transparent optical element.
10. The package of claim 1 , wherein the die comprises an array of optical devices.
11. The method of claim 13 , wherein the transparent optical element is selected from the group consisting of a filter and a lens.
12. The method of claim 11 , wherein the lens is selected from the group consisting of a rectangular lens and a spherical lens.
13. A method for creating a semiconductor package comprising:
mounting a die atop a package substrate, the die comprising an optical device;
mounting a transparent optical element atop the die;
forming a dam around the die;
depositing an encapsulant within the dam to entirely cover the die and to partially cover the transparent optical element.
14. The method of claim 13 , wherein the dam comprises a thixotropic epoxy.
15. The method of claim 13 , wherein said forming a dam comprises forming a rectangular dam with rounded corners.
16. The method of claim 13 , wherein the optical device is selected from the group consisting of a laser, a light emitting diode, and a photodiode.
17. The method of claim 16 , further comprising, prior to said depositing an encapsulant, mounting another die on the package substrate, said another die comprising a circuit driving the optical device, wherein the dam surrounds the die and said another die and the encapsulant covers the die and said another die.
18. A method for creating a semiconductor package comprising:
mounting a die atop a package substrate, the die comprising an optical device and the package substrate being selected from the group consisting of a printed circuit board and a ceramic substrate;
mounting a transparent optical element atop the die; and
depositing an encapsulant to entirely cover the die and to partially cover the transparent optical element.
19. A method for creating a semiconductor package comprising:
mounting a die atop a package substrate the die comprising an optical device and the package substrate comprising a ball grid array on a bottom surface;
mounting a transparent optical element atop the die; and
depositing an encapsulant to entirely cover the die and to partially cover the transparent optical element.
20. The method of claim 13 , wherein the die comprises an array of optical devices.
21. The package of claim 8 , wherein the transparent optical element is selected from the group consisting of a filter and a lens.
22. The package of claim 21 , wherein the lens is selected from the group consisting of a rectangular lens and a spherical lens.
23. The package of claim 9 , wherein the transparent optical element is selected from the group consisting of a filter and a lens.
24. The package of claim 23 , wherein the lens is selected from the group consisting of a rectangular lens and a spherical lens.
25. The method of claim 18 , wherein the transparent optical element is selected from the group consisting of a filter and a lens.
26. The method of claim 25 , wherein the lens is selected from the group consisting of a rectangular lens and a spherical lens.
27. The method of claim 19 , wherein the transparent optical element is selected from the group consisting of a filter and a lens.
28. The method of claim 27 , wherein the lens is selected from the group consisting of a rectangular lens and a spherical lens.