Polishing pad
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
1. A process for manufacturing a polishing pad, comprising the steps of:
(a) providing a non-woven fibrous component at a basis weight of 100–2500 g/m 2 , wherein said non-woven fibrous component comprises bicomponent fibers with two polymers contained within the same filament;
(b) providing a polymer matrix to coat said non-woven fibrous component;
(c) combining said non-woven fibrous component with said polymer matrix; and
(d) subjecting said polymer matrix and non-woven fibrous component to a temperature range and pressure to set density and thickness and form a composite sheet, and wherein said pad has a Shore D hardness of between about 10D to 70D.
2. The process of claim 1 wherein said bicomponent fibers include one component with a melting point of Tm 1 , one component with a melting point Tm 2 , wherein Tm 1 <Tm 2 , and wherein Tm 1 is within said temperature range.
3. The process of claim 1 wherein said fibrous component includes a binder fiber with a melting point that is within said temperature range.
4. The process of claim 1 wherein said temperature range is about 200–550° F.
5. The process of claim 1 wherein said pressure is up to about 2000 psi.
6. The process of claim 1 wherein said pressure is between about 500–2000 psi.
7. The process of claim 1 wherein said composite sheet includes a top surface and said top surface is abraded.
8. The process of claim 1 further including the step of cutting said composite sheet into shape to form said polishing pad.
9. The process of claim 1 wherein said bicomponent fibers are of a sheath/core configuration.
10. The process of claim 1 wherein the bicomponent fibers are comprised of polyethylene, polyethylene terephthalate, polyester, polyamide or polypropylene.
11. The process of claim 1 wherein the polymeric matrix component comprises a polyurethane, a polyacrylate, a polystyrene, a polyimide, a polyamide, a polycarbonate, an epoxy or combinations thereof.
12. The process of claim 1 further comprising providing a soluble or swellable polymer which solubilizes or swells in a polishing slurry.