IP Library › Granted Patent US 7,319,572
Granted Patent B2
US 7,319,572 · App. 10/849,194 · Granted Jan 15, 2008

Thin film coil and method of forming the same, and thin film magnetic head and method of manufacturing the same

Assignees: TDK Corporation; SAE Magnetick (H.K.) Ltd.
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Quick Facts
Patent No.
US 7,319,572
App. No.
10/849,194
Granted
Jan 15, 2008
Kind
B2
Abstract

Provided are a thin film coil formed at high densities, a method of forming a thin film coil, a thin film magnetic head which includes the thin film coil and thus enables ensuring stable recording characteristics while coping with a higher recording density, and a method of manufacturing a thin film magnetic head. The thin film coil includes a first coil having a top surface having the maximum width, an insulating wall formed by selectively etching an insulating layer filling a region between windings by using the first coil as a mask, and a second coil isolated from the first coil by the insulating wall. This easily enables forming the thin film coil in a narrower space, while ensuring electrical insulation between the windings of the first and second coils.

Claims (15)

1. A thin film coil including:

a spiral first coil formed on a substrate, the first coil being wound around an axis perpendicular to an in-plane direction of the substrate, the first coil having a width that varies in a direction parallel to the axis, the first coil having an end surface having a greatest width, the end surface being located opposite to the substrate;

a second coil formed in a region between windings of the first coil; and

an insulating wall which isolates the first coil from the second coil,

wherein the insulating wall becomes progressively thinner farther away from the substrate.

2. A thin film coil according to claim 1 , wherein the first coil has a progressively greater width farther away from the substrate.

3. A thin film coil according to claim 1 , wherein the first coil is formed by using plating, sputtering or chemical vapor deposition.

4. A thin film coil according to claim 1 , wherein the insulating wall is made of a cured fluidic organic material.

5. A thin film coil according to claim 1 , wherein the insulating wall is made of spin on glass (SOG).

6. A thin film magnetic head including: at least two magnetic layers magnetically coupled to each other and facing each other with a gap layer in between near and in a surface to be faced with a recording medium; and a thin film coil sandwiched in between the two magnetic layers or in between other magnetic layers coupled to the two magnetic layers,

the thin film coil including:

a spiral first coil formed on a substrate, the first coil being wound around an axis perpendicular to an in-plane direction of the substrate, the first coil having a width that varies in a direction parallel to the axis, the first coil having an end surface having a greatest width, the end surface being located opposite to the substrate;

a second coil formed in a region between windings of the first coil; and

an insulating wall which isolates the first coil from the second coil,

wherein the insulating wall becomes progressively thinner farther away from the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2004
From: IITSUKA, DAISUKE; KIMURA, FUJIMI
To: TDK CORPORATION; SAE MAGNETICS (H.K.) LTD.
Reel/Frame 015359/0859 →
Priority Claims (1)
JP 2003-153425 · May 29, 2003 · national
Continuity (1)
Related Publication 20040240106A1 · Dec 2, 2004