Method for assembling micro-components to binding sites

1. A method for assembling micro-components to binding sites on a support having a pattern of electrical conductors adapted to conduct electrical energy between binding sites, the method comprising the steps of:

passing an electrical signal through at least one conductive path including at least one of the conductors so that heat is generated by a portion of each conductive path proximate to the binding sites;

applying, to the support, a first fluid that is adapted to increase in viscosity when heated; and

applying, to the support, a carrier fluid having first micro-components adapted to engage the binding sites,

wherein the heat from the at least one conductive path increases the viscosity of the first fluid in areas proximate to the selected binding sites so as to inhibit first micro-components from engaging the binding sites.

2. The method of claim 1 , wherein the at least one conductor generates heat when an electrical signal is passed therethrough.

3. The method of claim 1 , wherein the conductive path includes an input conductor, an output conductor and a fluidic path between the input conductor portion and the output conductive portion, wherein the conductive path comprises the first fluid and wherein the electrical signal passing through the first fluid heats the first fluid to increase the viscosity of the first fluid in the binding site.

4. The method of claim 1 , wherein the conductive path includes an input conductor leading to a first binding site and also comprises an output conductor leading to a second binding site and wherein the electrical signal is applied after the first fluid is applied to the support so that the electrical signal passes from the input conductor through the first fluid and to the second conductor to increase the viscosity of the first fluid at the first and second binding sites.

5. The method of claim 1 , further comprising the step of removing the first fluid and any non-engaged micro-components from the first support, and applying a second fluid having second micro-components therein adapted to engage the support, so that the second micro-components can engage the selected binding sites.

6. The method of claim 5 , wherein the second fluid comprises a fluid that increases viscosity in response to heat and further comprising the step of passing an electrical current through less than all of the conductive paths associated with the selected binding sites so that the viscosity increases to inhibit micro-components from engaging selected ones of the binding sites.

7. The method of claim 1 , wherein an electrical current is passed through a portion of a conductor.

8. A method for assembling micro-components to binding sites on a support having a pattern of electrical conductors adapted to conduct electrical energy between binding sites; the method comprising the steps of:

passing an electrical signal through a first pattern of conductive pathways including at least one of the conductors so that a first pattern of heat is generated by the conductive pathways proximate to a first pattern of selected binding sites;

applying, to the support, a first fluid that is adapted to increase in viscosity when heated;

applying, to the support, a carrier fluid having first micro-components adapted to engage the binding sites;

removing, from the support, the carrier fluid, the first fluid and any of the first micro-components not engaged to a binding site;

passing a second electrical signal through a second pattern of conductive pathways that includes at least one of the conductors and that is different from the first pattern so a second pattern of heat is generated by the conductive pathways proximate to and a second pattern of selected binding sites;

applying, to the support, a second fluid that is adapted to increase in viscosity when heated; and

applying, to the support, a second carrier fluid having second micro-components adapted to engage the binding sites;

wherein the first pattern of heat from the conductive pathways increases the viscosity of the first fluid proximate to the first pattern of selected binding sites so as to inhibit first micro-components from engaging the first pattern of selected binding sites; and

wherein the second pattern of heat from the conductive pathways increases the viscosity of the second fluid proximate to the second pattern of selected binding sites so as to inhibit second micro-components from engaging the second pattern of selected binding sites.

9. The method of claim 8 , wherein a first set of contacts engages the conductive pathways of the first pattern to pass the first electrical signal to the first pattern of conductors, and wherein a second set of contacts engages the conductive pathways of the second pattern of conductive pathways to pass the second electrical signal to the second pattern of conductors.