IP Library Granted Patent US 7,081,644
Granted Patent B2
US 7,081,644 · App. 10/852,877 · Granted Jul 25, 2006

Overmolded lens on leadframe and method for overmolding lens on lead frame

Assignee: Barnes Group Inc.
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Quick Facts
Patent No.
US 7,081,644
App. No.
10/852,877
Granted
Jul 25, 2006
Kind
B2
Abstract

A light emitting diode (LED) assembly including an LED, an optically transmissive cover and a base for supporting the LED. The optically transmissive cover encapsulates the LED and includes a stiffener for reinforcing a base portion of the cover. The base includes electrical leads extending therefrom that are electrically connected to the LED. To make the cover, at least one support frame is formed in a strip of substantially rigid material. The at least one support frame is connected to a processing portion of the strip. At least one lens is overmolded on the at least one support frame that is connected to the processing portion. The overmolded support frame is removed from the processing portion of the strip.

Claims (27)

1. A lens cover assembly for covering a light emitting diode received in an open package, comprising:

a lens cover having a base portion and a dome portion integrally formed with said base portion, said dome portion being at least partially optically transmissive to allow light from the light emitting diode to pass therethrough; and

a support frame reinforcing said base portion of said lens cover for providing structural integrity to said lens cover.

2. The lens cover assembly of claim 1 wherein said support frame is a ring disposed on said base portion.

3. The lens cover assembly of claim 2 wherein said lens cover is formed of a relatively soft material and said support frame is stainless steel.

4. The lens cover assembly of claim 3 wherein said lens cover is formed of a silicone material.

5. The lens cover assembly of claim 1 wherein said support frame is entirely encased within said base portion of said lens cover.

6. The lens cover assembly of claim 1 further including a base supporting an LED thereon, said base and said light emitting diode together forming the open package to which said lens cover is attached to protect said light emitting diode.

7. The lens cover assembly of claim 1 wherein said base portion extends radially outwardly from said dome portion.

8. The lens cover assembly of claim 7 wherein said support frame is annularly received around said dome portion and against an upper surface of said radially extending base portion.

9. The lens cover assembly of claim 7 wherein said support frame is encapsulated entirely by said radially extending base portion.

10. The lens cover assembly of claim 1 wherein said support frame is formed of stainless steel and is positioned adjacent said base portion.

11. The lens cover assembly of claim 1 wherein said base portion of said lens cover is overmolded on said support frame.

12. The lens cover assembly of claim 11 wherein said support frame is stainless steel and said lens cover is silicone, said silicone lens cover overmolded on said stainless steel support frame.

13. A light emitting diode (LED) assembly, comprising:

an LED;

an optically transmissive cover assembly encapsulating said LED, said cover assembly including an optically transmissive cover formed of a relatively soft material and a stiffener formed of a material that is relatively harder than said cover for providing dimensional stability to said cover; and

a base for supporting said LED, said base having electrical leads extending therefrom that are electrically connected to said LED, said cover assembly received on said base.

14. The LED assembly of claim 13 further including:

bond wires electrically connecting said LED and said electrical leads.

15. The LED assembly of claim 13 wherein said cover includes a dome portion and an annular base portion extending radially outwardly from an open end of said dome portion.

16. The LED assembly of claim 15 wherein said stiffener is annularly shaped and disposed in abutting relation with said annular base portion.

17. The LED assembly of claim 16 wherein said stiffener is entirely encased within said base portion of said cover.

18. The LED assembly of claim 16 wherein said stiffener is disposed against a top surface of said base portion.

19. The LED assembly of claim 15 wherein said cover is formed of silicone and said stiffener is formed of stainless steel, said stiffener being one of (i) positioned adjacent said annular base portion of said silicone cover and (ii) encased by said annular base portion of said cover.

20. The LED assembly of claim 13 wherein said stiffener is formed of stainless steel and said cover is formed of a silicone material that is overmolded onto said stainless steel stiffener.

21. A lens cover assembly for encapsulating a light emitting device received on a support base, said lens cover assembly comprising a dome portion having a cavity within which said light emitting device resides, said lens cover assembly further comprising a base portion formed integrally with said dome portion and extending radially outwardly from an open end of said dome portion, said base portion engaged with the support base to encapsulate the light emitting diode received thereon, a support frame formed of a material relatively harder than said dome portion and said base portion, said support frame being overmolded by said dome portion and said base portion to provide increased dimensional stability to said dome portion and said base portion.

Assignments (11)
SECURITY INTEREST Recorded Aug 31, 2015
From: ANSONIA PLASTICS, LLC
To: ENTERPRISE BANK & TRUST
Reel/Frame 036459/0136 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF ASSIGNEE PREVIOUSLY RECORDED ON REEL 031173 FRAME 0287. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT ADDRESS OF THE ASSIGNEE. Recorded Oct 7, 2013
From: SPECTRUM PLASTICS GROUP, INC.
To: ANSONIA PLASTICS, LLC
Reel/Frame 031360/0464 →
SECURITY AGREEMENT Recorded Sep 16, 2013
From: ANSONIA PLASTICS, LLC
To: ENTERPRISE BANK & TRUST
Reel/Frame 031217/0892 →
DISCHARGE OF SECURITY INTEREST (PATENTS) Recorded Sep 10, 2013
From: MARQUETTE CAPITAL FUND I, LP, AS COLLATERAL AGENT AND AS SUCCESSOR IN SUCH CAPACITY TO CHURCHILL CAPITAL MEZZANINE FINANCE LLC
To: SPECTRUM PLASTICS GROUP, INC.
Reel/Frame 031192/0734 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2013
From: SPECTRUM PLASTICS GROUP, INC.
To: ANSONIA PLASTICS, LLC
Reel/Frame 031173/0287 →
DISCHARGE OF SECURITY INTEREST (PATENTS) Recorded Sep 3, 2013
From: ASSOCIATED BANK, N.A., AS AGENT
To: SPECTRUM PLASTICS GROUP, INC.
Reel/Frame 031156/0046 →
SECURITY AGREEMENT Recorded Oct 30, 2009
From: SPECTRUM PLASTICS GROUP, INC.
To: CHURCHILL CAPITAL MEZZANINE FINANCE LLC
Reel/Frame 023438/0944 →
SECURITY AGREEMENT Recorded Oct 1, 2009
From: SPECTRUM PLASTICS GROUP, INC.
To: ASSOCIATED BANK, N.A., AS AGENT FOR THE LENDERS
Reel/Frame 023312/0512 →
CHANGE OF NAME Recorded Jun 5, 2008
From: MIDWEST PLASTIC COMPONENTS, INC.
To: SPECTRUM PLASTICS GROUP, INC.
Reel/Frame 021050/0216 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2008
From: BARNES GROUP INC.
To: MIDWEST PLASTIC COMPONENTS, INC.
Reel/Frame 021040/0752 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2004
From: FLAHERTY, EDWARD M.; BUTKUS, TIMOTHY A.
To: BARNES GROUP, INC.
Reel/Frame 015388/0394 →
Continuity (2)
Provisional Application 6054256100 · Feb 6, 2004
Related Publication 20050174767A1 · Aug 11, 2005