IP Library › Granted Patent US 7,083,305
Granted Patent B2
US 7,083,305 · App. 10/854,551 · Granted Aug 1, 2006

LED lighting assembly with improved heat management

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Quick Facts
Patent No.
US 7,083,305
App. No.
10/854,551
Granted
Aug 1, 2006
Kind
B2
Abstract

The present invention provides a lighting head assembly that incorporates a high intensity LED package into an integral assembly including a heat sink and circuit board for further incorporation into other useful lighting devices. The present invention primarily includes a heat sink member that also serves as a mounting die and a reflector cup into which the LED package is mounted. The circuit board is placed behind the reflector cup and includes riser members that extend through holes in the rear wall of the reflector cup to facilitate electrical connections to the leads of the LED. This particular means for assembly allows the reflector cup and circuit board to cooperate to retain the LED package, provide electrical and control connections, provide integral heat sink capacity and includes an integrated reflector cup. In this manner, high intensity LED packages can be incorporated into lighting assemblies through the use of the present invention by simply installing the present invention into a housing and providing power connections thereto.

Claims (20)

1. A light emitting diode assembly comprising:

a light emitting diode having a mounting base, said mounting base having a heat transfer plate on a rear surface thereof and a first and second contact lead extending from the sides thereof;

a mounting die, said mounting die being thermally conductive, said mounting die having a rear wall with a top surface, a bottom surface and two holes extending through said rear wall and a side wall extending upwardly from said top surface of said rear wall, said top surface and said side wall cooperating to form a cavity therein; and

a circuit board received adjacent said bottom surface of said rear wall of said mounting die, said circuit board having two electrically conductive riser members thereon, said risers extending through said holes in said rear wall,

wherein said light emitting diode is received in said cavity with said heat transfer plate in thermal communication with said top surface of said mounting die, said first and second contact leads being positioned above said holes and in electrical communication with said two riser members.

2. The light emitting diode assembly of claim 1 , wherein said first and second electrical leads are fastened to said riser members.

3. The light emitting diode assembly of claim 2 , wherein said first and second electrical leads are fastened to said riser members using a means selected from the group consisting of: mechanical fasteners, solder and electrically conductive adhesive.

4. The light emitting diode assembly of claim 1 , wherein said side walls of said mounting die server as a reflector cup to direct light output from said light emitting diode.

5. A flashlight assembly comprising:

at least one battery, said battery having a first and second electrical contact;

a flashlight head assembly including,

a light emitting diode having a mounting base, said mounting base having a heat transfer plate on a rear surface thereof and a first and second contact lead extending from the sides thereof,

a mounting die, said mounting die being thermally conductive, said mounting die having a rear wall with a top surface, a bottom surface and two holes extending through said rear wall and a side wall extending upwardly from said top surface of said rear wall, said top surface and said side wall cooperating to form a cavity therein, and

a circuit board received adjacent said bottom surface of said rear wall of said mounting die, said circuit board having two electrically conductive riser members thereon, said risers being in electrical communication with said first and second electrical contacts on said battery, said risers extending through said holes in said rear wall,

wherein said light emitting diode is received in said cavity with said heat transfer plate in thermal communication with said top surface of said mounting die, said first and second contact leads being positioned above said holes and in electrical communication with said two riser members;

an exterior enclosure; and

means for selectively energizing said light emitting diode disposed between and in electrical communication with said first and second contacts of said battery and said circuit board.

6. The flashlight assembly of claim 5 , wherein said first and second electrical leads are fastened to said riser members.

7. The flashlight assembly of claim 6 , wherein said first and second electrical leads are fastened to said riser members using a means selected from the group consisting of: mechanical fasteners, solder and electrically conductive adhesive.

8. The flashlight assembly of claim 5 , wherein said side walls of said mounting die server as a reflector cup to direct light output from said light emitting diode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2020
From: GALLI, ROBERT
To: EMISSIVE ENERGY CORP.
Reel/Frame 051789/0595 →
Continuity (6)
Continuation In Part 1083355600 · Apr 28, 2004
Continuation In Part 1079638000 · Mar 9, 2004
Continuation In Part 1065957500 · Sep 10, 2003
Continuation In Part 1031533600 · Dec 10, 2002
Provisional Application 6033889300 · Dec 10, 2001
Related Publication 20040212991A1 · Oct 28, 2004