Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications

1. An electronic printed circuit board structure for implementing enhanced reliability for printed circuit board high power dissipation applications, said electronic printed circuit board structure comprising: a printed circuit board including a plurality of electrical contact pads on a first surface and an opposite second surface; an electronic module including a bottom surface; said bottom surface including a plurality of contact sites, some of said plurality of contact sites correspond to the pads on said first surface of the printed circuit board; an associated stiffener; said associated stiffener including a stiffener cavity; a first interposer positioned between said first surface of the printed circuit board and said bottom surface of the module; said first interposer comprising a first interposer insulator and a plurality of electrically conductive elements, each said electrically conductive element adapted to electrically connect one of a plurality of electrical contact pads of the printed circuit board to a respective one of the contact sites on the surface of the module; a second interposer positioned between said opposite second surface of the printed circuit board and said associated stiffener; said second interposer comprises a second interposer insulator and a plurality of electrically conductive elements, each of said plurality of electrically conductive elements adapted to electrically connect one of a sub-plurality of return current electrical contact pads of the printed circuit board to an external return current member; and said external return current member providing a return current path outside of the printed circuit board, thereby minimizing power dissipation within the printed circuit board.

2. An electronic printed circuit board structure as recited in claim 1 wherein said external return current member comprises said associated stiffener; said associated stiffener being formed of electrically conductive material.

3. An electronic printed circuit board structure as recited in claim 1 wherein said external return current member comprises a sheet of electrically conductive material received within said stiffener cavity and an insulator is provided between said sheet and said associated stiffener.

4. An electronic printed circuit board structure as recited in claim 1 wherein said external return current member comprises a metal plate defining said associated stiffener.

5. An electronic printed circuit board structure as recited in claim 1 wherein at least some of said return current electrical contact pads of the printed circuit board are connected to plated through holes in the printed circuit board.

6. An electronic printed circuit board structure for implementing enhanced reliability for printed circuit board high power dissipation applications, said electronic printed circuit board structure comprising:

a printed circuit board including a plurality of electrical contact pads on a first surface and an opposite second surface;

an electronic module including a bottom surface; said bottom surface including a plurality of contact sites, some of said plurality of contact sites correspond to the pads on said first surface of the printed circuit board;

an associated stiffener spaced apart from said opposite second surface of the printed circuit board;

a first interposer positioned between said first surface of the printed circuit board and said bottom surface of the module; said first interposer comprising a first interposer insulator and a plurality of compressible spring elements, each compressible spring element adapted to electrically connect one of a plurality of electrical contact pads of the printed circuit board to a respective one of the contact sites on the surface of the module;

a second interposer positioned between said opposite second surface of the printed circuit board and said associated stiffener; said second interposer received within a stiffener cavity defined by said associated stiffener; said second interposer comprises a second interposer insulator and a plurality of compressible spring elements, each of said plurality of compressible spring elements adapted to electrically connect one of a sub-plurality of return current electrical contact pads of the printed circuit board to an external return current member; said external return current member providing a return current path outside of the printed circuit board, thereby minimizing power dissipation within the printed circuit board.

7. An electronic printed circuit board structure as recited in claim 6 wherein said external return current member comprises said associated stiffener; said associated stiffener being formed of electrically conductive material.

8. An electronic printed circuit board structure as recited in claim 6 wherein said external return current member comprises a sheet of electrically conductive material and an insulator is provided between said sheet and said associated stiffener.

9. An electronic printed circuit board structure as recited in claim 6 wherein said external return current member comprises a metal plate defining said associated stiffener.

10. An electronic printed circuit board structure as recited in claim 6 wherein at least some of said return current electrical contact pads of the printed circuit board are connected to plated through holes in the printed circuit board.