Method and apparatus for detecting end point
View Patent ↗A mask layer and a to-be-processed layer are irradiated with light to measure interference light formed of reflected lights from the mask layer and reflected lights from the to-be-processed layer. Thereafter, an interference component brought by the mask layer is removed from the waveform of the measured interference light, thereby calculating the waveform of the interference light brought by the to-be-processed layer. The thickness of the remaining to-be-processed layer is determined on the basis of the calculated waveform of the interference light and the thickness of the remaining to-be-processed layer is compared with a desired thickness thereof. In this way, an end point of processing on the to-be-processed layer is detected.
1. A method for detecting an end point used in processing a to-be-processed layer using a mask layer formed on the to-be-processed layer, said method comprising the steps of:
irradiating the mask layer and the to-be-processed layer with light to measure interference light formed of reflected lights from the mask layer and reflected lights from the to-be-processed layer;
removing an interference component brought by the mask layer from the waveform of the measured interference light to calculate the waveform of the interference light brought by the to-be-produced layer; and
determining the thickness of the remaining to-be-processed layer on the basis of the calculated waveform of the interference light and comparing the determined thickness of the remaining to-be-processed layer to a desired thickness thereof, thereby detecting the end point of processing on the to-be-processed layer, wherein
the step of calculating the waveform of the interference light brought by the to-be-processed layer comprises the step of determining the ratio of the intensity of the measured interference light for at least one kind of specific wavelength to the sum of the intensities of the measured interference light for at least ten kinds of wavelengths within a predetermined wavelength range to remove the interference component brought by the mask layer from the measured interference light.
2. A method for detecting an end point used in processing a to-be-processed layer using a mask layer formed on the to-be-processed layer, said method comprising the steps of:
irradiating the mask layer and the to-be-processed layer with light to measure interference light formed of reflected lights from the mask layer and reflected lights from the to-be-processed layer;
removing an interference component brought by the mask layer from the waveform of the measured interference light to calculate the waveform of the interference light brought by the to-be-produced layer; and
determining the thickness of the remaining to-be-processed layer on the basis of the calculated waveform of the interference light and comparing the determined thickness of the remaining to-be-processed layer to a desired thickness thereof, thereby detecting the end point of processing on the to-be-processed layer, wherein
the step of calculating the waveform of the interference light brought by the to-be-processed layer comprises the step of determining the ratio of the intensity of the measured interference light for at least one kind of specific wavelength to the integral of the intensity of the measured interference over a predetermined wavelength range to remove the interference component brought by the mask layer from the measured interference light.
3. The method for detecting an end point of claim 1 , wherein
the lower limit of the predetermined wavelength range is 400 nm or more.
4. The method for detecting an end point of claim 1 , wherein
the width of the predetermined wavelength range is 100 nm or more.
5. The method for detecting an end point of claim 1 , wherein
the predetermined wavelength range includes a wavelength range from 400 nm to 800 nm.
6. The method for detecting an end point of claim 1 , wherein
the specific wavelength falls within the predetermined wavelength range.
7. The method for detecting an end point of claim 1 , wherein
the specific wavelength is an integral multiple of the desired thickness of the remaining to-be-processed layer.
8. A method for detecting an end point used in processing a to-be-processed layer using a mask layer formed on the to-be-processed layer, said method comprising the steps of:
irradiating the mask layer and the to-be-processed layer with light to measure interference light formed of reflected lights from the mask layer and reflected lights from the to-be-processed layer;
removing an interference component brought by the mask layer from the waveform of the measured interference light to calculate the waveform of the interference light brought by the to-be-produced layer; and
determining the thickness of the remaining to-be-processed layer on the basis of the calculated waveform of the interference light and comparing the determined thickness of the remaining to-be-processed layer to a desired thickness thereof, thereby detecting the end point of processing on the to-be-processed layer, wherein
the step of calculating the waveform of the interference light brought by the to-be-processed layer comprises the step of predicting the interference component brought by the mask layer based on the initial thickness of the mask layer, the initial thickness of the to-be-processed layer, the etching rate of the to-be-processed layer, and the etching rate of the mask layer and removing the predicted interference component from the measured interference light.
9. The method for detecting an end point of claim 1 , wherein
in the step of detecting the end point of processing on the to-be-processed layer, a maximum or a minimum in the waveform of the calculated interference light is used.
10. The method for detecting an end point of claim 1 , wherein
the to-be-processed layer is a semiconductor layer or a silicide layer formed on any one of a semiconductor substrate, a dielectric on the semiconductor substrate and an underlying layer on the semiconductor substrate.
11. The method for detecting an end point of claim 1 , wherein
the mask layer is formed of a photopolymer film or a dielectric.
12. A method for processing a to-be-processed layer using a mask layer formed on the to-be-processed layer, wherein
an end point of processing on the to-be-processed layer is detected using the method for detecting an end point of claim 1 .
13. The processing method of claim 12 , wherein
the end point of processing on the to-be-processed layer is detected during the processing on the to-be-processed layer.
14. The processing method of claim 12 , wherein
plasma etching is used in the processing on the to-be-processed layer.
15. The processing method of claim 12 , wherein
chemical mechanical polishing is used in the processing on the to-be-processed layer.
16. The method for detecting an end point of claim 2 , wherein
the lower limit of the predetermined wavelength range is 400 nm or more.
17. The method for detecting an end point of claim 2 , wherein
the width of the predetermined wavelength range is 100 nm or more.
18. The method for detecting an end point of claim 2 , wherein
the predetermined wavelength range includes a wavelength range from 400 nm to 800 mm.
19. The method for detecting an end point of claim 2 , wherein
the specific wavelength falls within the predetermined wavelength range.
20. The method for detecting an end point of claim 8 , wherein
in the step of detecting the end point of processing on the to-be-processed layer, a maximum or a minimum in the waveform of the calculated interference light is used.
21. The method for detecting an end point of claim 8 , wherein
the to-be processed layer is a semiconductor layer or a suicide layer formed on any one of a semiconductor substrate, a dielectric on the semiconductor substrate and an underlying layer on the semiconductor substrate.
22. The method for detecting an end point of claim 8 , wherein
the mask layer is formed of a photopolymer film or a dielectric.