Patent Assignment
Reel/Frame 031961/0079
Change of Name
Recorded: 2014-01-10
Pages: 5
Assignor
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Executed: 2008-10-01
Assignee
PANASONIC CORPORATION
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Properties
(53)
Semiconductor Device and Method of Fabricating the Same
Patent:
6,432,803 →
Application:
09/452,460 →
Method of Fabricating Semiconductor Device
Patent:
6,455,436 →
Application:
09/479,243 →
Method of manufacturing a semiconductor device
Patent:
6,376,373 →
Application:
09/523,985 →
Method of Fabricating Semiconductor Device
Patent:
6,436,747 →
Application:
09/551,541 →
Semiconductor device and method of fabricating the same
Patent:
6,300,242 →
Application:
09/560,299 →
Method for Fabricating a Semiconductor Device
Patent:
6,436,786 →
Application:
09/570,545 →
Method for Forming Interlayer Dielectric Film
Patent:
6,458,720 →
Application:
09/625,187 →
Semiconductor Device and Method for Fabricating the Same
Patent:
6,624,076 →
Application:
09/672,860 →
Method of Forming Electrode Structure and Method of Fabricating Semiconductor Device
Patent:
6,451,690 →
Application:
09/679,617 →
Method of Forming Electrode Structure and Method of Fabricating Semiconductor Device
Patent:
6,509,254 →
Application:
09/680,053 →
Capacitance Element and Method of Manufacturing the Same
Patent:
6,562,677 →
Application:
09/689,840 →
Semiconductor Device and Method for Fabricating the Same
Patent:
6,518,169 →
Application:
09/708,082 →
High-Voltage Semiconductor Device
Semiconductor Misfet
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Method for Etching Organic Film, Method for Fabricating Semiconductor Device and Pattern Formation Method
Semiconductor Device and Method for Fabricating the Same
Interconnect Structure and Method for Forming the Same
Semiconductor Device and Method for Fabricating the Same
Method for Fabricating Semiconductor Device
Patent:
7,037,371 →
Application:
09/856,823 →
Semiconductor Device and Method for Fabricating the Same
Production Method for Semiconductor Crystal
Semiconductor Device
Method of Fabricating Semiconductor Device
Method for Forming a Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Method for measuring temperature, annealing method and method for fabricating semiconductor device
Method for Fabricating Electronic Device
Semiconductor Device and Method for Fabricating the Same
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Electric Device and Method for Fabricating the Same
Manufacturing Method for an Electronic Device, and the Electronic Device
Production Method of Semiconductor Device
Method for Fabricating Semiconductor Device
Composition for Forming Porous Film, Porous Film and Method for Forming the Same, Interlevel Insulator Film, and Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Method for Fabricating Semiconductor Device and Semiconductor Device
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Semiconductor Device and Method for Fabricating the Same
Method and Apparatus for Detecting End Point
Semiconductor Memory Device
Method for Forming Metal Interconnect in a Carbon Containing Silicon Oxide Film
Semiconductor Device and Method for Fabricating the Same
Method and Apparatus for Fabricating Semiconductor Device
Semiconductor Device Including Fine Dummy Patterns
Method and Apparatus for Detecting End Point
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Method for Fabricating a Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Method for Forming Inlaid Interconnect
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2014
From: YUASA, HIROSHI; UEDA, SATOSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 031934/0136 →
Assignment of Assignor's Interest
Jan 10, 2014
From: AOI, NOBUO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 031934/0113 →
Assignment of Assignor's Interest
Jan 14, 2014
From: MIKAWA, TAKUMI; JUDAI, YUJI; NAGANO, YOSHIHISA
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 031956/0765 →
Assignment of Assignor's Interest
Jan 14, 2014
From: TSUZUMITANI, AKIHIKO; OKUNO, YASUTOSHI; MORI, YOSHIHIRO
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 031956/0772 →
Assignment of Assignor's Interest
Jan 14, 2014
From: DOMAE, SHINICHI; MASUDA, HIROSHI; KATO, YOSHIAKI; YANO, KOUSAKU
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 031956/0680 →
Merger
Jan 16, 2014
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 031979/0894 →
Assignment of Assignor's Interest
May 5, 2014
From: PANASONIC CORPORATION (FORMERLY KNOWN AS MATSUSHITA ELECTRIC INDUSTRIAL, CO., LTD.)
To: RPX CORPORATION
Reel/Frame 032826/0585 →
Security Agreement
Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001)
Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest
Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Lien on Patents
Oct 21, 2019
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: RPX CORPORATION
Reel/Frame 050777/0983 →
Release of Lien on Patents
Dec 12, 2019
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: RPX CORPORATION
Reel/Frame 051261/0517 →
Assignment of Assignor's Interest
Dec 25, 2019
From: RPX CORPORATION
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 051364/0328 →
Assignment of Assignor's Interest
Feb 7, 2020
From: RPX CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 051842/0494 →
Patent Security Agreement
Oct 23, 2020
From: RPX CLEARINGHOUSE LLC; RPX CORPORATION
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 054198/0029 →
Patent Security Agreement
Oct 23, 2020
From: RPX CLEARINGHOUSE LLC; RPX CORPORATION
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 054244/0566 →
Release of Security Interest
Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →