IP Library Assignment 031956/0680
Patent Assignment
Reel/Frame 031956/0680

Assignment of Assignor's Interest

Recorded: 2014-01-14 Pages: 5
Assignors
DOMAE, SHINICHI
Executed: 1998-07-08
MASUDA, HIROSHI
Executed: 1998-07-08
KATO, YOSHIAKI
Executed: 1998-07-08
YANO, KOUSAKU
Executed: 1998-07-08
Assignee
MATSUSHITA ELECTRONICS CORPORATION
1-1,SAIWAI-CHO,TAKATSUKI-SHI, OSAKA, 569-1193, JAPAN
Covered Properties (7)
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 6,580,176 →
Application: 09/760,640 →
Publication: US 2001/0004551
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 6,815,338 →
Application: 10/443,826 →
Publication: US 2004/0092097
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 7,148,572 →
Application: 10/837,596 →
Publication: US 2004/0201104
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 7,443,031 →
Application: 11/582,982 →
Publication: US 2007/0037453
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 7,642,654 →
Application: 12/236,914 →
Publication: US 2009/0111262
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 7,911,060 →
Application: 12/631,592 →
Publication: US 2010/0078827
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 8,110,495 →
Application: 13/022,950 →
Publication: US 2011/0129995
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Jan 10, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 031961/0079 →
Merger Jan 16, 2014
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 031979/0894 →
Assignment of Assignor's Interest May 5, 2014
From: PANASONIC CORPORATION (FORMERLY KNOWN AS MATSUSHITA ELECTRIC INDUSTRIAL, CO., LTD.)
To: RPX CORPORATION
Reel/Frame 032826/0585 →
Security Agreement Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001) Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Security Interest Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →