IP Library › Assignment 031979/0894
Patent Assignment
Reel/Frame 031979/0894

Merger

Recorded: 2014-01-16 Pages: 9
Assignor
MATSUSHITA ELECTRONICS CORPORATION
Executed: 2001-04-04
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Properties (10)
Capacitance Element and Method of Manufacturing the Same
Patent: 6,562,677 →
Application: 09/689,840 →
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 6,580,176 →
Application: 09/760,640 →
Publication: US 2001/0004551
Semiconductor Device and Method for Fabricating the Same
Patent: 6,531,729 →
Application: 09/855,773 →
Publication: US 2001/0023977
Semiconductor Device and Method for Fabricating the Same
Patent: 6,962,853 →
Application: 10/337,338 →
Publication: US 2003/0134517
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 6,815,338 →
Application: 10/443,826 →
Publication: US 2004/0092097
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 7,148,572 →
Application: 10/837,596 →
Publication: US 2004/0201104
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 7,443,031 →
Application: 11/582,982 →
Publication: US 2007/0037453
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 7,642,654 →
Application: 12/236,914 →
Publication: US 2009/0111262
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 7,911,060 →
Application: 12/631,592 →
Publication: US 2010/0078827
Multilayer Wiring Structure of Semiconductor Device, Method of Producing Said Multilayer Wiring Structure and Semiconductor Device to Be Used for Reliability Evaluation
Patent: 8,110,495 →
Application: 13/022,950 →
Publication: US 2011/0129995
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Jan 10, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 031961/0079 →
Assignment of Assignor's Interest Jan 14, 2014
From: DOMAE, SHINICHI; MASUDA, HIROSHI; KATO, YOSHIAKI; YANO, KOUSAKU
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 031956/0680 →
Assignment of Assignor's Interest Jan 14, 2014
From: SEGAWA, MIZUKI; UEHARA, TAKASHI
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 031956/0775 →
Assignment of Assignor's Interest Jan 14, 2014
From: TSUZUMITANI, AKIHIKO; OKUNO, YASUTOSHI; MORI, YOSHIHIRO
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 031956/0772 →
Assignment of Assignor's Interest Jan 14, 2014
From: MIKAWA, TAKUMI; JUDAI, YUJI; NAGANO, YOSHIHISA
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 031956/0765 →
Assignment of Assignor's Interest May 5, 2014
From: PANASONIC CORPORATION (FORMERLY KNOWN AS MATSUSHITA ELECTRIC INDUSTRIAL, CO., LTD.)
To: RPX CORPORATION
Reel/Frame 032826/0585 →
Security Agreement Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001) Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Lien on Patents Oct 21, 2019
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: RPX CORPORATION
Reel/Frame 050777/0983 →
Assignment of Assignor's Interest Feb 7, 2020
From: RPX CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 051842/0494 →
Release of Security Interest Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →