IP Library › Granted Patent US 6,580,176
Granted Patent Utility
US 6,580,176 · Confirmation No. 3463

MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PRODUCING SAID MULTILAYER WIRING STRUCTURE AND SEMICONDUCTOR DEVICE TO BE USED FOR RELIABILITY EVALUATION

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2014-08-07 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2014-08-07 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2014-07-18 PA.. Power of Attorney 1 View
2014-07-18 MFEE.C.AD Maintenance Fee Address Change 1 View
2014-07-18 N417 Electronic Filing System Acknowledgment Receipt 2 View
2014-07-18 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2001-01-17 TRNA Transmittal of New Application 3 View
2001-01-17 SPEC Specification 37 View
2001-01-17 CLM Claims 8 View
2001-01-17 ABST Abstract 1 View
2001-01-17 DRW Drawings-only black and white line drawings 19 View
2001-01-17 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,580,176
App. No.
09/760,640
Filed
2001-01-17
Granted
2003-06-17
Pub. No.
US20010004551A1
Art Unit
2823
PTA
-61 days