Semiconductor device and method for fabricating the same
View Patent ↗A method for fabricating a semiconductor device includes the steps of: forming a first insulating film on a semiconductor substrate; removing part of the first insulating film; forming a second insulating film having a leakage current density higher than that of the first insulating film on a region where the part of the first insulating film has been removed on the semiconductor substrate; forming an undoped semiconductor film on the first and second insulating films; implanting an impurity into part of the undoped semiconductor film, thereby defining semiconductor regions of a first conductivity type dotted as discrete islands; forming a third insulating film on the semiconductor regions of the first conductivity type and the undoped semiconductor film; and removing part of the third insulating film by wet etching. At least the second insulating film is formed under the semiconductor regions of the first conductivity type.
1. A semiconductor device, comprising:
an insulating film formed on a substrate;
a first semiconductor region into which an impurity is implanted, and which is formed on the insulating film; and
a second semiconductor region of an undoped type formed on the insulating film so as to surround the first semiconductor region,
wherein the insulating film includes a first portion and a second portion, and the first portion of the insulating film has a thickness larger than that of the second portion of the insulating film,
a polysilicon resistor is formed in the first semiconductor region including the second portion, and
the average density of leakage current from the first semiconductor region of a first conductivity type to the outside of the first and second portions of the insulating film has an absolute value of 1×10 =10 (A/mm 2 ) or more when the potential difference between the first semiconductor region of the first conductivity type and the outside of the first and second portions of the insulating film has an absolute value of 1.5 V.
2. The semiconductor device of claim 1 , wherein
the second portion of the insulating film is a silicon oxide film, a silicon nitride film, an undoped silicon oxide film, a TEOS film, or a thermal oxidation film.
3. The semiconductor device of claim 1 , wherein
a film material of the second portion of the insulating film is different from a film material of the first portion of the insulating film.
4. The semiconductor device of claim 1 , wherein
the first semiconductor region is a silicon film into which a p-type impurity or an n-type impurity is implanted.
5. The semiconductor device of claim 1 , wherein
the second portion of the insulating film has a leakage current density higher than that of the first portion of the insulating film.
6. A semiconductor device, comprising:
an insulating film formed on a substrate;
a first semiconductor region into which an impurity is implanted, and which is formed on the insulating film; and
a second semiconductor region of an undoped type formed on the insulating film so as to surround the first semiconductor region,
wherein the insulating film includes a first portion and a second portion, the first portion of the insulating film is larger than the second portion of the insulating film, and the first portion of the insulating film has a thickness larger than that of the second portion of the insulating film,
a polysilicon resistor and a gate electrode are formed in the first semiconductor region,
the second portion of the insulating film is formed between the polysilicon resistor and the gate electrode, and
the average density of leakage current from the first semiconductor region of a first conductivity type to the outside of the first and second portions of the insulating film has an absolute value of 1×10 −10 (A/mm 2 ) or more when the potential difference between the first semiconductor region of the first conductivity type and the outside of the first and second portions of the insulating film has an absolute value of 1.5 V.
7. The semiconductor device of claim 6 , wherein
the second portion of the insulating film is a silicon oxide film, a silicon nitride film, an undoped silicon oxide film, a TEOS film, or a thermal oxidation film.
8. The semiconductor device of claim 6 , wherein
a film material of the second portion of the insulating film is different from a film material of the first portion of the insulating film.
9. The semiconductor device of claim 6 , wherein
the first semiconductor region is a silicon film into which a p-type impurity or an n-type impurity is implanted.
10. The semiconductor device of claim 6 , wherein
the second portion of the insulating film has a leakage current density higher than that of the first portion of the insulating film.
11. A semiconductor device, comprising:
an insulating film formed on a substrate;
a first semiconductor region into which an impurity of a first conductivity type is implanted, and which is formed on the insulating film; and
a second semiconductor region of a second conductivity type formed on the insulating film so as to surround the first semiconductor region,
wherein the insulating film includes a first portion and a second portion, the first portion of the insulating film is larger than the second portion of the insulating film, and the first portion of the insulating film has a thickness larger than that of the second portion of the insulating film,
a polysilicon resistor is formed in the first semiconductor region including the second portion, and
the average density of leakage current from the first semiconductor region of the first conductivity type to the outside of the first and second portions of the insulating film has an absolute value of 1×10 −10 (A/mm 2 ) or more when the potential difference between the first semiconductor region of the first conductivity type and the outside of the first and second portions of the insulating film has an absolute value of 1.5 V.
12. The semiconductor device of claim 11 , wherein
the second portion of the insulating film is a silicon oxide film, a silicon nitride film, an undoped silicon oxide film, a TEOS film, or a thermal oxidation film.
13. The semiconductor device of claim 11 , wherein
a film material of the second portion of the insulating film is different from a film material of the first portion of the insulating film.
14. The semiconductor device of claim 11 , wherein
the second portion of the insulating film has a leakage current density higher than that of the first portion of the insulating film.
15. The semiconductor device of claim 11 , wherein
the first semiconductor region is a silicon film into which a p-type impurity is implanted, and the second semiconductor region is a silicon film into which an n-type impurity is implanted.
16. The semiconductor device of claim 11 , wherein
the first semiconductor region is a silicon film into which an n-type impurity is implanted, and the second semiconductor region is a silicon film into which a p-type impurity is implanted.
17. A semiconductor device, comprising:
an insulating film formed on a substrate;
a first semiconductor region into which an impurity of a first conductivity type is implanted, and which is formed on the insulating film; and
a second semiconductor region of a second conductivity type formed on the insulating film so as to surround the first semiconductor region,
wherein the insulating film includes a first portion and a second portion, the first portion of the insulating film is larger than the second portion of the insulating film, and the first portion of the insulating film has a thickness larger than that of the second portion of the insulating film,
a polysilicon resistor and a gate electrode are formed in the first semiconductor region including the second portion,
the second portion of the insulating film is formed between the polysilicon resistor and the gate electrode, and
the average density of leakage current from the first semiconductor region of the first conductivity type to the outside of the first and second portions of the insulating film has an absolute value of 1×10 −10 (A/mm 2 ) or more when the potential difference between the first semiconductor region of the first conductivity type and the outside of the first and second portions of the insulating film has an absolute value of 1.5 V.
18. The semiconductor device of claim 17 , wherein
the second portion of the insulating film is a silicon oxide film, a silicon nitride film, an undoped silicon oxide film, a TEOS film, or a thermal oxidation film.
19. The semiconductor device of claim 17 , wherein
a film material of the second portion of the insulating film is different from a film material of the first portion of the insulating film.
20. The semiconductor device of claim 17 , wherein
the second portion of the insulating film has a leakage current density higher than that of the first portion of the insulating film.
21. The semiconductor device of claim 17 , wherein
the first semiconductor region is a silicon film into which a p-type impurity is implanted, and the second semiconductor region is a silicon film into which an n-type impurity is implanted.
22. The semiconductor device of claim 17 , wherein
the first semiconductor region is a silicon film into which an n-type impurity is implanted, and the second semiconductor region is a silicon film into which a p-type impurity is implanted.