Semiconductor device and method for fabricating the same

1. A method for fabricating a semiconductor device comprising the steps of:

depositing a first metal film on a semiconductor substrate with an insulating film sandwiched therebetween;

depositing a second metal film on said first metal film;

forming an interlayer insulating film on said second metal film;

forming a via hole in said interlayer insulating film;

forming an adhesive layer on said via hole;

then, removing a part of said adhesive layer present on a bottom of said via hole selectively so as to expose a surface of said second metal film only at the bottom of said via hole;

forming a plug of a third metal film selectively grown on the exposed surface of said second metal film within said via hole;

forming a patterned interlayer insulating film by patterning said interlayer insulating film into the shape of interconnects; and

forming metal interconnects from a multi-layer film composed of said first metal film and said second metal film by etching said multi-layer film with said plug and said patterned interlayer insulating film used as a mask,

wherein said first metal film is an interconnected layer and said second metal film is a seed layer, and

said plug is in contact with said seed layer only at the bottom of said via hole.

2. The method for fabricating a semiconductor device of claim 1 ,

wherein said third metal film is grown by plating.

3. The method for fabricating a semiconductor device of claim 1 ,

wherein said second metal film and said third metal film are made from the same type of metal.

4. The method for fabricating a semiconductor device of claim 1 ,

wherein said second metal film and said third metal film are made from a metal including copper as a principal constituent, and

said third metal film is grown by plating an said second metal film with no adhesive layer sandwiched therebetween.

5. A semiconductor device, comprising:

metal interconnects formed on a semiconductor substrate with an insulating film sandwiched therebetween, and the metal interconnects including a first metal film of a lower layer and a second metal film of an upper layer;

an interlayer insulating film formed over the metal interconnects;

a via hole formed in the interlayer insulating film;

a plug made from a third metal film formed within the via hole,

wherein the first metal film is an interconnect Layer and the second metal film is a seed layer, and

the plug is in contact with said seed layer only at the bottom of said via hole.

6. The semiconductor device of claim 5 , further comprising an adhesive layer formed only on walls of the via hole.

7. The semiconductor device of claim 6 ,

wherein the adhesive layer is made of a silicon nitride film or a silicon carbide film.

8. The semiconductor device of claim 5 ,

wherein no seed layer is formed within the via hole.

9. The semiconductor device of claim 5 ,

wherein the interlayer insulating film is formed on the metal interconnects, and includes a patterned first interlayer insulating film and a second interlayer insulating film formed over the first interlayer insulating film.

10. A method for fabricating a semiconductor device comprising the steps of:

depositing first metal film on a semiconductor substrate with an insulating film sandwiched therebetween;

depositing a second metal film on said first metal film;

forming an interlayer insulating film on said second metal film;

forming a via hole in said interlayer insulating film so as to expose a surface of said second metal film only at the bottom of said via hole,

forming a plug of a third metal film selectively grown on the exposed surface of said second metal film within said via hole;

forming a patterned interlayer insulating film by patterning said interlayer insulating film into the shape of interconnects; and

forming metal interconnects from a multi-layer film composed of said first metal film and said second metal film by etching said multi-layer film with said plug and said patterned interlayer insulating film used as a mask,

wherein said first metal film is an interconnected layer and said second metal film is a seed layer, and

said plug is in contact with said seed layer only at the bottom of said via hole;

wherein the step of forming said via hole so as to expose the surface of said second metal film only at the bottom of said via hole includes the steps of:

depositing an adhesive layer over walls and the bottom of said via hole, and

performing an anisotropic etching with respect to said adhesive layer so as to have said adhesive layer only on the walls of said via hole.