Patent Application
Utility
App. No. 10/861,450
· Confirmation No. 1042
Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2006-03-09 | ABN |
Abandonment | 2 | View | |
| 2005-06-23 | CTNF |
Non-Final Rejection | 5 | View | |
| 2005-06-23 | 1449 |
List of References cited by applicant and considered by examiner | 3 | View | |
| 2005-06-23 | 892 |
List of references cited by examiner | 1 | View | |
| 2005-06-23 | SRFW |
Search information including classification, databases and other search related notes | 1 | View | |
| 2005-06-23 | FWCLM |
Index of Claims | 1 | View | |
| 2005-06-20 | SRNT |
Examiner's search strategy and results | 1 | View | |
| 2004-09-13 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2004-09-13 | FWCLM |
Index of Claims | 1 | View | |
| 2004-06-07 | TRNA |
Transmittal of New Application | 2 | View | |
| 2004-06-07 | SPEC |
Specification | 75 | View | |
| 2004-06-07 | CLM |
Claims | 7 | View | |
| 2004-06-07 | ABST |
Abstract | 1 | View | |
| 2004-06-07 | DRW |
Drawings-only black and white line drawings | 19 | View | |
| 2004-06-07 | OATH |
Oath or Declaration filed | 2 | View | |
| 2004-06-07 | A.PE |
Preliminary Amendment | 1 | View | |
| 2004-06-07 | SPEC |
Specification | 1 | View | |
| 2004-06-07 | REM |
Applicant Arguments/Remarks Made in an Amendment | 2 | View | |
| 2004-06-07 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 5 | View | |
| 2004-06-07 | FRPR |
Certified Copy of Foreign Priority Application | 1 | View | |
| 2004-06-07 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2004-06-07 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Hiroto Kawagoe
Tokyo, JAPAN
Tatsumi Shirasu
Kawasaki-shi, JAPAN
Shogo Kiyota
Tokyo, JAPAN
Norio Suzuki
Tokyo, JAPAN
Eiichi Yamada
Kumage-gun, JAPAN
Yuji Sugino
Nakakoma-gun, JAPAN
Manabu Kitano
Yanai-shi, JAPAN
Yoshihiko Sakurai
Nakakoma-gun, JAPAN
Takashi Naganuma
Nakakoma-gun, JAPAN
Hisashi Arakawa
Kohfu-shi, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/197
H10D84/857
H10P14/20
H10D84/0167
H10D84/038
Prosecution
Foreign Priority
6-265529
·
1994-10-28
·
JAPAN
6-176872
·
1994-07-28
·
JAPAN
Publication
- Pub. No.
- US20040219727A1
- Pub. Date
- 2004-11-04
Parent
is a Continuation of
→
App. 10/014,405
· US 6,806,130
Filed 2001-12-14
· Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Parent
is a Continuation of
→
App. 10/002,147
· US 6,630,375
Filed 2001-12-05
· Patented Case
Parent
is a Continuation of
→
App. 09/513,349
· US 6,368,905
Filed 2000-02-25
· Patented Case
Parent
is a Continuation of
→
App. 08/934,774
· US 6,043,114
Filed 1997-09-22
· Patented Case
Parent
is a Division of
→
App. 08/508,483
Filed 1995-07-28
· Abandoned -- Failure to Respond to an Office Action
No recorded assignments were found for this patent.
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