IP Library › Granted Patent US 6,630,375
Granted Patent Utility
US 6,630,375 · Confirmation No. 3988

PROCESS FOR MANUFACTURING A SEMICONDUCTOR WAFER, A SEMICONDUCTOR WAFER, PROCESS FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

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 Code Description Pages PDF
2001-12-05 TRNA Transmittal of New Application 5 View
2001-12-05 A.PE Preliminary Amendment 4 View
2001-12-05 SPEC Specification 75 View
2001-12-05 CLM Claims 3 View
2001-12-05 ABST Abstract 1 View
2001-12-05 DRW Drawings-only black and white line drawings 19 View
2001-12-05 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,630,375
App. No.
10/002,147
Filed
2001-12-05
Granted
2003-10-07
Pub. No.
US20020055204A1
Art Unit
2812
PTA
0 days