IP Library Granted Patent US 7,220,346
Granted Patent B2
US 7,220,346 · App. 10/861,821 · Granted May 22, 2007

Methods for fabricating metal nanowires

Assignee: Regents of the University of California
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Quick Facts
Patent No.
US 7,220,346
App. No.
10/861,821
Granted
May 22, 2007
Kind
B2
Abstract

Methods for the preparation of long, dimensionally uniform, metallic nanowires that are removable from the surface on which they are synthesized. The methods include the selective electrodeposition of metal nanowires at step edges present on a stepped surface, such as graphite, from an aqueous solution containing a metal or metal oxide. Where a metal oxide is first deposited, the metal oxide nanowires are reduced via a gas phase reduction at elevated temperatures to metal nanowires. Alternatively, beaded or hybrid nanowires comprising a metal A into which nanoparticles of a metal B have been inserted may be prepared by first electrodepositing nanoparticles of metal B selectively along step edges of a stepped surface, capping these nanoparticles with a molecular layer of an organic ligand, selectivley electrodepositing nanowire segments of metal A between nanoparticles of metal B and then heating the surface of the hybrid nanowire under reducing conditions to remove the ligand layer. In all three methods, the nanowires may be removed from the stepped surface by embedding the wires in a polymer film, and then peeling this film containing the embedded wires off of the stepped surface.

Claims (23)

1. A method for preparing metallic nanometer scale wires comprising the steps of

electrodepositing a metal at a step edge present on a stepped surface to form a wire, and

removing the wire off of the stepped surface.

2. The method of claim 1 wherein the electrodepositing step includes electrodepositing metal from an aqueous solution including a desired metal.

3. The method of claim 2 wherein the electrodepositing step includes applying a nucleation pulse to the aqueous solution.

4. The method of claim 3 wherein the electrodepositing step further includes applying a deposition potential to the aqueous solution.

5. The method of claim 4 wherein the over potential corresponding to the deposition potential is less than about −400 millivolts.

6. The method of claim 1 further comprising the step of embedding the wire in a film of material.

7. The method of claim 6 wherein the film of material comprises a polymer.

8. The method of claim 6 wherein the removing step includes lifting the film and embedded wire off of the stepped surface.

9. A method for preparing metallic nanowires comprising the steps of

electrodepositing metal oxide at step edges present on a stepped surface to form a metal oxide wire,

reducing the metal oxide wire to a metal wire, and

removing the metal wire from the stepped surface.

10. The method of claim 9 wherein the electrodepositing step includes electrodepositing metal oxide particles from an aqueous solution including a desired metal oxide.

11. The method of claim 10 wherein the electrodepositing step includes applying a deposition potential to the solution.

12. The method of claim 11 wherein the over potential corresponding to the deposition potential is less than 900 millivolts.

13. The method of claim 9 wherein the reducing step includes reducing the metal oxide wire to a metal wire via gas phase reduction.

14. The method of claim 13 wherein the reducing step includes reducing the metal oxide wire in hydrogen gas.

15. The method of claim 13 wherein the reducing step includes reducing the metal oxide wire at about 500° C.

16. The method of claim 9 further comprising the step of embedding the metal wire in a film of material.

17. The method of claim 16 wherein the film of material comprises a polymer.

18. The method of claim 16 wherein the removing step includes lifting the film and embedded wire off of the stepped surface.

Assignments (1)
CONFIRMATORY LICENSE Recorded May 17, 2010
From: UNIVERSITY OF CALIFORNIA
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 024392/0581 →
Continuity (4)
Continuation 0997699000 · Oct 12, 2001
Provisional Application 6030671500 · Jul 20, 2001
Provisional Application 6031786200 · Sep 5, 2001
Related Publication 20040238367A1 · Dec 2, 2004