Method and apparatus for manipulating a microscopic sample
View Patent ↗In the semiconductor industry, microscopic samples are cut out of substrates for purposes of analysis. In the case of a known method, a sample to be cut loose out of a substrate is attached to a sample carrier connected to a manipulator and the sample is cut loose from the substrate. Subsequently, the sample is fixed to a TEM grid and completely separated from the sample carrier. According to the invention, the sample carrier 3 is left in connection with the sample 1 and the sample carrier 3 is separated from the manipulator 4 . By making the sample carrier 3 connected to the sample 1 much bigger than the (microscopic) sample 1 , and by manipulating the sample carrier 3 , manipulation—with the aid of a (macroscopic) manipulator—of the microscopic sample 1 attached thereto becomes easier than manipulating the sample 1 without the sample carrier 3 attached thereto. In addition, a mechanical coupling between manipulator 4 and sample carrier 3 is shown, which enables a great degree of automation.
1. A method of manipulating a microscopic sample to be extracted from a substrate, whereby the manipulating movements are conducted with the aid of a manipulation system consisting of a sample carrier and a manipulator, which method comprises the following steps:
attaching the sample to the sample carrier and completely severing the sample from the substrate, and;
subsequently applying a separation to the sample and the manipulator,
characterized in that the separation is applied between the manipulator and the sample carrier in such a manner that, after applying the separation, a portion of the sample carrier that protrudes with respect to the sample remains attached to the sample.
2. A method according to claim 1 , whereby the sample carrier has a rod-like extremity and the location where the sample is attached to the sample carrier is the rod-like extremity of the sample carrier.
3. A method according to claim 1 , whereby the sample carrier is formed by an end portion of a supply of wire, and whereby the separation is applied by separating the end portion of the supply of wire from the supply of wire.
4. A method according to claim 3 , whereby the method comprises stretching the wire of the supply of wire, at the location of the separation area where the separation is to occur, in such a manner that constriction of the wire occurs.
5. A method according to claim 1 , whereby the sample carrier is detachably coupled to the manipulator.
6. A method according to claim 5 , whereby the sample carrier is embodied to carry several samples.
7. A method according to claim 5 , whereby the sample carrier is provided with a unique identification code.
8. A method according to claim 5 , whereby the sample carrier is attached to a flat holder with a hollow in such a manner that the sample is located within the hollow so as to be substantially free all around.
9. A method according to claim 8 , whereby attachment of the sample carrier to the flat holder occurs by mechanical clamping.
10. A method according to claim 8 , whereby the flat holder is provided with a unique identification code.
11. A particle-optical apparatus for performing the method according to claim 3 , provided with:
a particle source for producing a particle beam to cut a sample loose out of a substrate;
a manipulator for moving a sample carrier to a position on a substrate where the sample is to be extracted from the substrate,
characterized in that the particle-optical device is provided with a supply of wire for the purpose of forming a sample carrier and that the particle-optical apparatus is provided with severing means for applying a separation between the supply of wire and an end portion of the supply of wire for the purpose of obtaining the sample carrier.
12. Particle-optical apparatus for performing the method according to claim 5 , provided with:
a particle source for producing a particle beam to cut a sample loose out of a substrate;
a manipulator for moving a sample carrier to a position on a substrate where the sample is to be extracted from the substrate,
characterized in that the manipulator comprises a coupling mechanism for detachably attaching the sample carrier to the manipulator.
13. A method according to claim 2 , whereby the sample carrier is formed by an end portion of a supply of wire, and whereby the separation is applied by separating the end portion of the supply of wire from the supply of wire.
14. A method according to claim 13 , whereby the method comprises stretching the wire of the supply of wire, at the location of the separation area where the separation is to occur, in such a manner that constriction of the wire occurs.
15. A method according to claim 2 , whereby the sample carrier is detachably coupled to the manipulator.
16. A method according to claim 15 , whereby the sample carrier is embodied to carry several samples.
17. A method according to claim 15 , whereby the sample carrier is attached to a flat holder with a hollow in such a manner that the sample is located within the hollow so as to be substantially free all around.
18. A method according to claim 16 , whereby the sample carrier is attached to a flat holder with a hollow in such a manner that the sample is located within the hollow so as to be substantially free all around.
19. A method according to claim 9 , whereby the flat holder is provided with a unique identification code.
20. A particle-optical apparatus for performing the method according to claim 4 , provided with:
a particle source for producing a particle beam to cut a sample loose out of a substrate;
a manipulator for moving a sample carrier to a position on a substrate where the sample is to be extracted from the substrate,
characterized in that the particle-optical device is provided with a supply of wire for the purpose of forming a sample carrier and that the particle-optical apparatus is provided with severing means for applying a separation between the supply of wire and an end portion of the supply of wire for the purpose of obtaining the sample carrier.
21. Particle-optical apparatus for performing the method according to claim 8 , provided with:
a particle source for producing a particle beam to cut a sample loose out of a substrate;
a manipulator for moving a sample carrier to a position on a substrate where the sample is to be extracted from the substrate,
characterized in that the manipulator comprises a coupling mechanism for detachably attaching the sample carrier to the manipulator.
22. Particle-optical apparatus for performing the method according to claim 15 , provided with:
a particle source for producing a particle beam to cut a sample loose out of a substrate;
a manipulator for moving a sample carrier to a position on a substrate where the sample is to be extracted from the substrate,
characterized in that the manipulator comprises a coupling mechanism for detachably attaching the sample carrier to the manipulator.