Chip-type solid electrolytic capacitor and method of producing the same
View Patent ↗A chip-type solid electrolytic capacitor comprises capacitor elements. A cathode terminal comprising a plate-like conductor is interposed between cathode layers of the capacitor elements. The capacitor elements are bonded to each other by a bonding agent such as a solder or a conductive adhesive. The cathode terminal is provided with a through hole formed at a portion to be brought into contact with each of the capacitor elements. Bonding surfaces of the capacitor elements are directly connected at the through hole.
1. A chip-type solid electrolytic capacitor comprising:
a plurality of capacitor elements each of which includes an anode member comprising a sintered body of a valve metal, a dielectric oxide layer, a cathode layer formed on a surface of the dielectric oxide layer, and an anode lead connected to the anode member, the capacitor elements being electrically connected in parallel to one another; and
at least one plate-like cathode terminal provided between two of the capacitor elements such that the cathode layers of the two capacitor elements face each other via the cathode terminal;
wherein confronting surfaces of the cathode layers are bonded to each other;
wherein the anode leads are connected to an anode terminal; and
at least one of a through hole and a cutout is formed in the cathode terminal at a position contacting the cathode layers between which the cathode terminal is positioned.
2. A chip-type solid electrolytic capacitor according to claim 1 , wherein:
the capacitor elements are bonded to each other by filling a bonding agent at an interface between each of the cathode layers and the cathode terminal and in the at least one of the through hole and the cutout.
3. A chip-type solid electrolytic capacitor according to claim 1 , wherein:
the respective anode leads corresponding to the capacitor elements are spaced from one another in a direction perpendicular to bonding surfaces of the capacitor elements.
4. A chip-type solid electrolytic capacitor according to claim 3 , wherein:
the anode terminal has a plurality of branched portions at least equal in number to the plurality of capacitor elements; and
the anode leads are spaced from one another in a direction perpendicular to bonding surfaces of the capacitor elements and are individually respectively connected to the branched portions.
5. A chip-type solid electrolytic capacitor according to claim 2 , wherein:
the respective anode leads corresponding to the capacitor elements are spaced from one another in a direction perpendicular to bonding surfaces of the capacitor elements.
6. A chip-type solid electrolytic capacitor according to claim 5 , wherein:
the anode terminal has a plurality of branched portions at least equal in number to the plurality of capacitor elements; and
the anode leads are spaced from one another in a direction perpendicular to bonding surfaces of the capacitor elements and are individually respectively connected to the branched portions.