Nitride semiconductor light emitting diode and fabrication method thereof
View Patent ↗The invention relates to a nitride semiconductor LED and a fabrication method thereof. In the LED, a first nitride semiconductor layer, an active region a second nitride semiconductor layer of a light emitting structure are formed in their order on a transparent substrate. A dielectric mirror layer is formed on the underside of the substrate, and has at least a pair of alternating first dielectric film of a first refractivity and a second dielectric film of a second refractivity larger than the first refractivity. A lateral insulation layer is formed on the side of the substrate and the light emitting structure. The LED of the invention effectively collimate undesirably-directed light rays, which may be otherwise extinguished, to maximize luminous efficiency, and are protected by the dielectric mirror layer formed on the side thereof to remarkably improve ESD characteristics.
1. A nitride semiconductor Light Emitting Diode (LED) comprising:
a transparent substrate for growing nitride semiconductor single crystal thereon;
a light emitting structure including a first nitride semiconductor layer, an active region, and a second nitride semiconductor layer formed in that order on the substrate; a dielectric mirror layer formed on the underside of the substrate and having at least a pair of first dielectric film of a first refractivity and a second dielectric film of a second refractivity larger than the first refractivity, the first and second dielectric films being laminated on each other an alternating fashion; and
a lateral insulation layer formed on the side of the substrate and the light emitting structure.
2. The nitride semiconductor light emitting diode according to claim 1 , wherein the lateral insulation layer comprises a dielectric mirror layer equal to the dielectric mirror layer formed on the underside of the substrate.
3. The nitride semiconductor light emitting diode according to claim 1 , wherein the first and second dielectric films comprise oxide or nitride containing one element selected from a group including Si, Zr, Ta, Ti and Al.
4. The nitride semiconductor light emitting diode according to claim 1 , wherein each of the first and second dielectric films has a thickness of about 300 to 900 Å.
5. The nitride semiconductor light emitting diode according to claim 1 , wherein each of the first and second dielectric films comprises a SiO 2 film or a Si 3 N 4 film.
6. The nitride semiconductor light emitting diode according to claim 5 , wherein the SiO 2 film has a thickness of about 600 to 600 Å, and the Si 3 N 4 film has a thickness of about 400 to 600 Å.
7. The nitride semiconductor light emitting diode according to claim 1 , wherein the dielectric mirror layer has a reflectivity of at least 90%.
8. The nitride semiconductor light emitting diode according to claim 7 , wherein the dielectric mirror layer has a reflectivity of at least 95%.