Method for the formation of silicides
A process for forming a silicide on top of at least one silicon portion on the surface of a semiconductor wafer, comprising the following steps: a) implanting, at a defined depth in the silicon portion, through a dielectric layer, of ions that have the property of limiting the silicidation of metals; b) performing heat treatment; c) depositing a metal layer, the metal being capable of forming a silicide by thermal reaction with the silicon; d) performing rapid thermal processing suitable for siliciding the metal deposited at step c); and e) removing the metal that has not reacted to the thermal processing of step d). Advantageously, the thickness of the silicide layer created at step d) is controlled by a suitable choice of the depth of the implantation carried out in step a).
1 . A method for forming a silicide on top of a silicon portion on the surface of a semiconductor wafer, comprising the following steps:
a) implanting, at a defined depth in the silicon portion, of ions that have the property of limiting the silicidation of metals;
b) performing a heat treatment;
c) depositing a metal layer, said metal layer being capable of forming a suicide by thermal reaction with the silicon;
d) performing a rapid thermal processing suitable for siliciding the metal layer deposited at step c); and
e) removing metal from the metal layer that has not reacted to the thermal processing of step d);
wherein the thickness of the silicide created at step d) is controlled by an appropriate choice of the depth of the implantation carried out at step a).
2 . A method according to claim 1 wherein the implantation of step a) is a wafer-scale implantation.
3 . A method according to claim 1 wherein the ions implanted at step a) are non-dopant ions.
4 . A method according to claim 1 wherein the ions implanted at step a) are heavy ions.
5 . A method according to claim 3 wherein the ions implanted at step a) are selected from the group consisting of Ge, Xe and Ar ions.
6 . A method according to claim 1 wherein the metal layer deposited at step c) is selected from the group consisting of Co, Ni, Pt, and Ti.
7 . A method according to claim 1 wherein, at step a), the ions are implanted through a dielectric layer, which is removed during a removal step coming between steps b) and c).
8 . A method according to claim 7 wherein the dielectric layer is an SiO 2 layer deposited using TEOS, said dielectric layer serving as a mask for another operation.
9 . A method according to claim 1 wherein the heat treatment of step b) is an annealing treatment for activating dopant species implanted beforehand in the silicon portion and/or in other portions of the wafer.
10 . A MOS transistor comprising:
a silicide layer on top of a defined region of silicon;
ions implanted into said region just below the silicide layer, said ions having the property of limiting the silicidation of metals.
11 . A MOS transistor of claim 10 wherein the ions implanted are non-dopant ions.
12 . A MOS transistor of claim 10 wherein the ions implanted are heavy ions.
13 . A MOS transistor of claim 11 wherein the ions implanted are selected from the group consisting of Ge, Xe and Ar ions.
14 . A process of forming a semiconductor device, comprising:
implanting silicide-limiting ions into a silicon region;
depositing a metal layer on the silicon region implanted with silicide-limiting ions; and
heating the metal layer such that a suicide layer is formed on the silicon region.
15 . A process according to claim 14 wherein the silicide-limiting ions are non-dopant ions.
16 . A process according to claim 14 wherein the silicide-limiting ions are heavy ions.
17 . A process according to claim 15 wherein the silicide-limiting ions are selected from the group consisting of Ge, Xe and Ar ions.
18 . A process according to claim 14 , further comprising:
forming a dielectric layer on the silicon region, wherein said implanting step including implanting through said dielectric layer and removing said dielectric layer after the implanting step.