IP Library Granted Patent US 7,445,800
Granted Patent B2
US 7,445,800 · App. 10/877,322 · Granted Nov 4, 2008

Method for remediating mold and mildew using acidic electrolyzed water

Assignee: EAU Technologies, Inc.
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Quick Facts
Patent No.
US 7,445,800
App. No.
10/877,322
Granted
Nov 4, 2008
Kind
B2
Abstract

Methods for remediating mold and mildew are provided using acidic electrolyzed water. Acidic electrolyzed A water, electrolyzed C water or combination of electrolyzed A and C water is released into an infected area through a high pressure sprayer, a mister or an electrostatic sprayer. Upon contacting the infected area, mold and mildew growing in the infected area is remedied.

Claims (17)

1. A method for remediating mold and mildew in an infected area, comprising the step of:

spraying acidic electrolyzed water onto the surface of the infected area using a high pressure sprayer to wash the infected area, thereby remediating mold and mildew in the infected area;

wherein the acidic electrolyzed water has an oxidative/reduction potential of about 1,160 + -1,170 + mV and a pH of about 1.8-2.4, and contains about 10-200 ppm of hypochlorous acid.

2. The method of claim 1 , the method further comprising the step of:

scrubbing the infected area.

3. A method for remediating mold and mildew in an infected area, comprising the step of:

spraying acidic electrolyzed water onto the surface of the infected area using a high pressure sprayer to wash the infected area, thereby remediating mold and mildew in the infected area;

wherein the acidic electrolyzed water has a stabilized oxidative/reduction potential of about 850 + mV and a pH of up to about 5, and contains about 10-200 ppm of hypochlorous acid.

4. The method of claim 3 , the method further comprising the step of:

scrubbing the infected area.

5. A method for remediating mold and mildew in an infected area, comprising the step of:

spraying acidic electrolyzed water onto the surface of the infected area using a high pressure sprayer to wash the infected area, thereby remediating mold and mildew in the infected area,

wherein the acidic electrolyzed water comprises:

water having an oxidative/reduction potential of about 1,160 + -1,170 + mV and a pH of about 1.8-2.4, and contains about 10-200 ppm of hypochlorous acid; and

water having a stabilized oxidative/reduction potential of about 850 + mV and a pH of up to about 5, and contains about 10-200 ppm of hypochlorous acid.

6. The method of claim 5 , the method further comprising the step of:

scrubbing the infected area.

Assignments (2)
CHANGE OF NAME Recorded Sep 26, 2008
From: ELECTRIC AQUAGENICS UNLIMITED, INC.
To: EAU TECHNOLOGIES, INC.
Reel/Frame 021596/0548 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2004
From: MORRIS, CHAD D.; STONE, JAMES K.
To: ELECTRIC AQUAGENICS UNLIMITED
Reel/Frame 015526/0136 →
Continuity (2)
Provisional Application 6048236800 · Jun 25, 2003
Related Publication 20040265394A1 · Dec 30, 2004