IP Library Granted Patent US 7,129,501
Granted Patent B2
US 7,129,501 · App. 10/880,262 · Granted Oct 31, 2006

Radiation detector system having heat pipe based cooling

Assignee: SII Nanotechnology USA, Inc.
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Quick Facts
Patent No.
US 7,129,501
App. No.
10/880,262
Granted
Oct 31, 2006
Kind
B2
Abstract

A radiation detector system having a heat pipe based cooling. The radiation detector system includes a radiation detector thermally coupled to a thermo electric cooler (TEC). The TEC cools down the radiation detector, whereby heat is generated by the TEC. A heat removal device dissipates the heat generated by the TEC to surrounding environment. A heat pipe has a first end thermally coupled to the TEC to receive the heat generated by the TEC, and a second end thermally coupled to the heat removal device. The heat pipe transfers the heat generated by the TEC from the first end to the second end to be removed by the heat removal device.

Claims (27)

1. A radiation detector system comprising:

a radiation detector for use with a spectrometer;

a TEC thermally coupled to the radiation detector for cooling the radiation detector, whereby heat is primarily generated by the TEC;

a heat removal device for dissipating the heat generated by the TEC to surrounding environment; and

a heat pipe having a first end thermally coupled to the TEC to receive the heat generated by the TEC, and a second end thermally coupled to the heat removal device, wherein the heat pipe transfers the heat generated by the TEC from the first end to the second end to be removed by the heat removal device.

2. The radiation detector system of claim 1 , wherein the heat removal device includes a heat sink.

3. The radiation detector system of claim 2 , further comprising a fan disposed proximately to the heat sink for dissipating the heat from the heat sink to the surrounding environment.

4. The radiation detector system of claim 1 , wherein the heat removal device includes a water cooling system or a refrigeration system.

5. The radiation detector system of claim 1 , wherein the heat removal device comprises a second TEC having a cold side thermally coupled to the second end of the heat pipe to remove the heat therefrom and a hot side thermally coupled to a radiator for dissipating the heat to the surrounding environment.

6. The radiation detector system of claim 1 , further comprising front-end electronics for providing a first signal amplification stage and a feedback signal based on a temperature of the radiation detector, and a controller for regulating a current flow in the TEC in response to a feedback signal to maintain a substantially constant temperature at the cold side of the TEC.

7. The radiation detector system of claim 5 , further comprising electronic circuitry for providing a first feedback signal based on a temperature of the radiation detector and a second feedback signal based on a temperature of the cold side of the second TEC, and a controller for regulating a current flow in the TEC in response to the first feedback signal to maintain a substantially constant temperature at the cold side of the TEC, and for regulating a current flow in the second TEC in response to the second feedback signal to maintain another substantially constant temperature at the cold side of the second TEC.

8. The radiation detector system of claim 1 , further comprising front end electronic components, wherein the radiation detector and the front-end electronic components are contained either in vacuum or dry gas, and wherein at least a portion of the heat pipe is placed outside said vacuum or dry gas.

9. The radiation detector system of claim 1 , further comprising front end electronic components, wherein the radiation detector, the front-end electronic components, the TEC and at least a portion of the heat pipe are contained either in vacuum or dry gas.

10. The radiation detector system of claim 1 , wherein the heat pipe is formed as a straight rod.

11. The radiation detector system of claim 1 , wherein the heat pipe is formed as a spring to damp vibrations.

12. The radiation detector system of claim 1 , wherein the heat pipe is thermally coupled with at least one of the TEC and the heat removal device using solder.

13. The radiation detector system of claim 1 , wherein the heat pipe is thermally coupled with at least one of the TEC and the heat removal device using a thermal compound.

14. The radiation detector system of claim 1 , wherein the heat pipe is thermally coupled with either the TEC or the heat removal device using solder and thermally coupled with the other of the TEC and the heat removal device using a thermal compound.

15. The radiation detector system of claim 1 , wherein the radiation detector is a low leakage current p-i-n, a drift type detector, a high resistivity compound semiconductor detector, or a Si(Li) detector.

16. A radiation detector system comprising:

a spectrometer comprising radiation detection means;

a TEC thermally coupled to the radiation detection means for cooling the radiation detection means, whereby heat is generated by the TEC;

heat removal means for dissipating the heat generated by the TEC to surrounding environment; and

a heat pipe having a first end thermally coupled to the TEC to receive the heat generated by the TEC, and a second end thermally coupled to the heat removal means, wherein the heat pipe transfers the heat generated by the TEC from the first end to the second end.

17. The radiation detector system of claim 16 , wherein the heat removal means includes a heat sink.

18. The radiation detector system of claim 17 , further comprising heat dissipation means disposed proximately to the heat sink for dissipating the heat from the heat sink to the surrounding environment.

19. The radiation detector system of claim 16 , wherein the heat removal means comprises a second TEC whose cold side is thermally coupled to the second end of the heat pipe and whose hot side is thermally coupled to a radiator for dissipating the heat to the surrounding environment.

Assignments (3)
CHANGE OF NAME Recorded Apr 10, 2013
From: SII NANOTECHNOLOGY USA INC.
To: HITACHI HIGH-TECHNOLOGIES SCIENCE AMERICA, INC.
Reel/Frame 030193/0067 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2005
From: PHOTON IMAGING, INC.
To: SII NANOTECHNOLOGY USA, INC.
Reel/Frame 016708/0153 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2004
From: IWANCZYK, JAN S.; SAVELIEV, VALERI D.; BARKAN, SHAUL
To: PHOTON IMAGING, INC.
Reel/Frame 015758/0668 →
Continuity (1)
Related Publication 20050285046A1 · Dec 29, 2005