Bipolar transistor with geometry optimized for device performance, and method of making same
View Patent ↗The present invention is generally directed to bipolar transistors with geometry optimized for device performance and various methods of making same. In one illustrative embodiment, the device includes a substrate, an intrinsic base region formed in the substrate, a continuous emitter region formed within the intrinsic base region, the emitter region having a plurality of substantially hexagonal shaped openings defined therein, and a plurality of extrinsic base regions formed in the substrate, wherein each of the extrinsic base regions is positioned within an area defined by one of the plurality of substantially hexagonal shaped openings.
1. A bipolar junction transistor, comprising:
a substrate;
an intrinsic base region formed in said substrate;
a continuous emitter region formed within said intrinsic base region, said emitter region having a plurality of substantially hexagonal shaped openings defined therein; and
a plurality of extrinsic base regions formed in said substrate, wherein each of said extrinsic base regions is positioned within an area defined by one of said plurality of substantially hexagonal shaped openings.
2. The device of claim 1 , further comprising at least one conductive contact coupled to said continuous emitter region and at least one conductive conduct coupled to each of said plurality of extrinsic base regions.
3. The device of claim 1 , further comprising an extrinsic base ring formed in said substrate around said continuous emitter region, at least a portion of said intrinsic base region being positioned between said continuous emitter region and said extrinsic base ring.
4. The device of claim 1 , wherein said bipolar junction transistor is a power bipolar junction transistor.
5. The device of claim 1 , wherein said continuous emitter region has an approximately constant width between each of said plurality of substantially hexagonal openings.
6. The device of claim 1 , wherein said bipolar junction transistor is an NPN bipolar junction transistor.
7. The device of claim 1 , wherein said bipolar junction transistor is a PNP bipolar junction transistor.
8. The device of claim 1 , wherein each of said plurality of extrinsic base regions has a substantially hexagonal shape.
9. The device of claim 1 , wherein said substrate is an active layer of an SOI substrate.
10. The device of claim 1 , wherein said substrate is a bulk semiconducting material.
11. The device of claim 1 , wherein said extrinsic base regions extend below said intrinsic base region.
12. A bipolar junction transistor, comprising:
a substrate;
an intrinsic base region formed in said substrate;
a continuous emitter region formed within said intrinsic base region, said emitter region having a plurality of substantially hexagonal shaped openings defined therein;
a plurality of substantially hexagonal shaped extrinsic base regions formed in said substrate, wherein each of said substantially hexagonal shaped extrinsic base regions is positioned within an area defined by one of said plurality of substantially hexagonal shaped openings; and
at least one conductive contact coupled to said continuous emitter region.
13. The device of claim 12 , further comprising an extrinsic base ring formed in said substrate around said continuous emitter region, at least a portion of said intrinsic base region being positioned between said continuous emitter region and said extrinsic base ring.
14. The device of claim 12 , wherein said bipolar junction transistor is a power bipolar junction transistor.
15. The device of claim 12 , wherein said continuous emitter region has an approximately constant width between each of said plurality of substantially hexagonal openings.
16. The device of claim 12 , wherein said bipolar transistor is an NPN bipolar junction transistor.
17. The device of claim 12 , wherein said bipolar transistor is a PNP bipolar junction transistor.
18. The device of claim 12 , wherein said substrate is an active layer of an SOI substrate.
19. The device of claim 12 , wherein said substrate is a bulk semiconducting material.
20. The device of claim 12 , wherein said extrinsic base regions extend below said intrinsic base region.
21. A bipolar junction transistor, comprising:
a substrate;
an intrinsic base region formed in said substrate;
a continuous emitter region formed within said intrinsic base region, said emitter region having a plurality of substantially hexagonal shaped openings defined therein, said continuous emitter region having an approximately constant width between each of said plurality of substantially hexagonal shaped openings; and
a plurality of substantially hexagonal shaped extrinsic base regions formed in said substrate, wherein each of said substantially hexagonal shaped extrinsic base regions is positioned within an area defined by one of said plurality of substantially hexagonal shaped openings.
22. The device of claim 21 , further comprising an extrinsic base ring formed in said substrate around said continuous emitter region, at least a portion of said intrinsic base region being positioned between said continuous emitter region and said extrinsic base ring.
23. The device of claim 21 , wherein said bipolar junction transistor is a power bipolar junction transistor.