Method of providing a low cost semiconductor transmitter photonic integrated circuit (TxPIC) chip
View Patent ↗A method of deploying a passive optical combiner that is a broad bandwidth spectral wavelength combiner for combining the outputs from multiples transmitter photonic integrated circuit (TxPIC) chips and, thereafter, the amplification of the combined channel signals with a booster optical amplifier couple between the passive optical combiner and the fiber transmission link. The booster optical amplifier may be a rear earth fiber amplifier, such as an erbium doped fiber amplifier (EDFA), or one or more semiconductor optical amplifiers (SOAs) on one or more semiconductor chips. Such a combination of optical components simplifies the design of individual TxPICs and other such optical communication PICs, which has to take into consideration the nonlinear effects of difficult, high loss single mode fiber (SMF) links or other fiber-type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted directly on the TxPIC chip through the deployment of on-chip optical amplifiers, such as semiconductor optical amplifiers (SOAs), integrated in locations following the electro-optic (EO) modulators, if not integrated also at other locations on the same chip.
1. A method of providing a semiconductor transmitter photonic integrated circuit (TxPIC) chip comprising the steps of:
fabricating a monolithic semiconductor transmitter photonic integrated circuit (TxPIC) chip having a plurality of modulated wavelength sources having different wavelengths approximating a standardized grid of wavelengths with their respective modulated signal outputs optically combined with an integrated optical combiner to provide a combined signal output;
eliminating from the fabricating step the integration of any on-chip amplification for the modulated signal outputs or the combined signal output; and
coupling the combined signal output, instead, into an off-chip booster optical fiber amplifier at an output of the chip prior to launching the combined signal output on an optical link so that the absence of on-chip amplification on the TxPIC chip reduces chip complexity by eliminating active on-chip amplifiers and reduces resultant power consumption and heat load on the TxPIC chip due to the elimination of the requirement for current bias to operate such active on-chip amplifiers.
2. The method of claim 1 wherein the booster optical fiber amplifier is a rare fiber amplifier.
3. The method of claim 1 wherein the booster optical fiber amplifier is a single stage erbium doped fiber amplifier (EDFA) pumped by a pump laser.
4. The method of claim 1 further comprising the steps of:
combining the signal outputs of a plurality of monolithic semiconductor transmitter photonic integrated circuit (TxPIC) chips through a broad bandwidth spectral power combiner and
coupling the combined output from the broad bandwidth spectral power combiner to the booster optical fiber amplifier comprising is a single stage erbium doped fiber amplifier (EDFA) so that any requirement for a wavelength-selective combiner for accomplishing this step is not necessary.
5. The method of claim 4 wherein said broad bandwidth spectral wavelength combiner is a multi-mode interference (MMI) coupler or a stir coupler.
6. A method of providing a semiconductor transmitter photonic integrated circuit (TxPIC) chip comprising the steps of:
deploying at least one monolithic semiconductor transmitter photonic integrated circuit (TxPIC) chip having a plurality of modulated sources having different wavelengths and producing a plurality of respective modulated signal outputs of different wavelengths;
deploying an integrated broad bandwidth spectral wavelength combiner on the TxPIC chip to combine the plurality of signal outputs into a single signal output;
eliminating any deployment of on-chip amplification on the TxPIC chip of the modulated signal outputs or the single signal output; and
coupling the single signal output into an off-chip booster optical amplifier at an output of the TxPIC chip prior to launching the combined signal output on an optical link thereby reducing chip complexity by eliminating active on-chip amplifiers as well as reducing resultant power consumption and heat load on the TxPIC chip due to the elimination of the requirement for current bias to operate such active on-chip amplifiers.
7. The method of claim 6 wherein said booster optical amplifier is an optical fiber amplifier on a semiconductor optical amplifier (SOA).
8. The method of claim 6 wherein said booster optical amplifier is an erbium doped fiber amplifier.
9. The method of claim 6 wherein said broad bandwidth spectral wavelength combiner is a multi-mode interference (MMI) coupler or a star coupler.