Patent Assignment
Reel/Frame 020353/0641
Release of Security Interest
Recorded: 2008-01-14
Pages: 4
Assignor
UNITED COMMERCIAL BANK
Executed: 2008-01-08
Assignee
INFINERA CORPORATION
169 JAVA DRIVE, SUNNYVALE, CALIFORNIA, 94089
Covered Properties
(46)
Digital Optical Network Architecture
Upgrade of Optical Amplifier Site to a Digital Optical Network Site in an Optical Transmission Network
AN OPTICAL SIGNAL RECEIVER, AN ASSOCIATED PHOTONIC INTEGRATED CIRCUIT (RxPIC), AND METHOD IMPROVING PERFORMANCE
Transmitter Photonic Integrated Circuit (Txpic) Chip Architectures and Drive Systems and Wavelength Stabilization for Txpics
Transmitter Photonic Integrated Circuits (Txpic) and Optical Transport Networks Employing Txpics
Transmitter Photonic Integrated Circuit (Txpic) Chip with Enhanced Power and Yield Without on-Chip Amplification
Heat Isolation and Dissipation Structures for Optical Components in Photonic Integrated Circuits (Pics) and an Optical Transport Network Using the Same
Electrical Isolation of Optical Components in Photonic Integrated Circuits (Pics)
Optical Communication Module with One or More Photonic Integrated Circuit (Pic) Chips and an External Booster Optical Amplifier for Photonic Integrated Circuits (Pics)
Architecture for multi-symbol encoding and decoding
Application:
10/301,174 →
Publication:
US 2003/0106013
Error Correction Improvement for Concatenated Codes
Optical Modulator Driver Circuit with Low Power Dissipation
Transmitter Photonic Integrated Circuit ( Txpic) Chips
Oxygen-Doped Al-Containing Current Blocking Layers in Active Semiconductor Devices
Inp-Based Photonic Integrated Circuits with Al-Containing Waveguide Cores and Inp-Based Array Waveguide Gratings (Awgs) and Avalanche Photodiodes (Apds) and Other Optical Components Containing an Inalgaas Waveguide Core
In-Wafer Testing of Integrated Optical Components in Photonic Integrated Circuits (Pics)
Method and Apparatus for Deploying Forward Error Correction in Optical Transmission Networks and the Deployment of Photonic Integrated Circuit (Pic) Chips with the Same
Optical Transmission Network with Asynchronous Mapping and Demapping and Digital Wrapper Frame for the Same
Electrical Isolation of Optical Components in Photonic Integrated Circuits (Pics)
Transmitter Photonic Integrated Circuit (Txpic) Chips Utilizing Compact Wavelength Selective Combiners/Decombiners
Submount for a Photonic Integrated Circuit (Pic) Chip
Oxygen-Doped Ai-Containing Current Blocking Layers in Active Semiconductor Devices
Optical Communication System with Multiple Photonic Integrated Circuit (Pic) Chips and an External Booster Optical Amplifier for Photonic Integrated Circuits (Pics)
Method of Providing a Low Cost Semiconductor Transmitter Photonic Integrated Circuit (Txpic) Chip
Optical Probe and Method of Testing Employing an Interrogation Beam or Optical Pickup
Method of Tuning Optical Components Integrated on a Monolithic Chip
Apparatus and Method for Tuning a Laser Source Emission Wavelength Employing a Laser Source Contact Comprising Electrode Segments
Method of Tuning Integrated Laser Sources with Integrated Wavelength Tuning Elements on the Same Substrate or in a Monolithic Photonic Integrated Circuit (Pic)
Method of Operating an Array of Laser Sources Integrated in a Monolithic Chip or in a Photonic Integrated Circuit (Pic)
Method and Apparatus of Monitoring and Controlling the Emission Wavelengths of a Plurality of Laser Sources Integrated on the Same Chip or in the Same Photonic Integrated Circuit (Pic)
Transmission Line with Low Dispersive Properties and Its Application in Equalization
Oxygen-Doped Al-Containing Current Blocking Layers in Active Semiconductor Devices in Photonic Integrated Circuits (Pics)
Monitoring of a Laser Source with Front and Rear Output Photodetectors to Determine Frontal Laser Power and Power Changes Over Laser Lifetime
Chromatic Dispersion Compensator (Cdc) in a Photonic Integrated Circuit (Pic) Chip and Method of Operation
Method and Apparatus for Providing an Antireflection Coating on the Output Facet of a Photonic Integrated Circuit (Pic) Chip
Method of in-Wafer Testing of Monolithic Photonic Integrated Circuits (Pics) Formed in a Semiconductor Wafer
Method of Calibrating a Monolithic Transmitter Photonic Integrated Circuit (Txpic) Chip
Probe Card for Testing in-Wafer Photonic Integrated Circuits (Pics) and Method of Use
Monolithic Transmitter/Receiver Photonic Integrated Circuit (Tx/Rxpic) Transceiver Chip
In-Wafer Testing of Integrated Optical Components in Photonic Integrated Circuits (Pics)
In-Wafer Testing of Integrated Optical Components in Photonic Integrated Circuits (Pics)
Method and Apparatus for a Polarization Insensitive Arrayed Waveguide Grating (Awg)
Method for Forming and Apparatus Comprising Optical Waveguides Leading to a Free Space Coupler Region
Method of Reducing Insertion Loss in a Transition Region Between a Plurality of Input or Output Waveguides to a Free Space Coupler Region
Passivation of Photonic Integrated Circuits (Pics)
Optical Waveguide Device with Reduced Insertion Loss Between Optical Waveguides Coupled to a Free Space Region
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 30, 2002
From: PETERS, FRANK H.; NAGARAJAN, RADHAKRISHNAN L.
To: INFINERA CORPORATION
Reel/Frame 013472/0659 →
Assignment of Assignor's Interest
Oct 30, 2002
From: PETERS, FRANK H.
To: INFINERA CORPORATION
Reel/Frame 013472/0694 →
Assignment of Assignor's Interest
Dec 11, 2002
From: BOTAK, JEFFERY S.; CHIANG, TING-KUANG
To: INFINERA CORPORATION
Reel/Frame 013579/0964 →
Assignment of Assignor's Interest
Jan 2, 2003
From: JOYNER, CHARLES H.; KISH, FRED A., JR.; PETERS, FRANK H.; MATHUR, ATUI
To: INFINERA CORPORATION
Reel/Frame 013621/0549 →
Assignment of Assignor's Interest
Jan 9, 2003
From: JARCHI, MICHAEL D.; SRIDHARAN, SATISH K.
To: INFINERA CORPORATION
Reel/Frame 013659/0923 →
Assignment of Assignor's Interest
Jan 9, 2003
From: JARCHI, MICHAEL D.; SRIDHARAN, SATISH K.
To: INFINERA CORPORATION
Reel/Frame 013659/0861 →
Assignment of Assignor's Interest
Jan 29, 2003
From: GRUBB, STEPHEN G.; MITCHELL, MATTHEW L.; TAYLOR, ROBERT B.; CHIANG, TING-KUANG
To: INFINERA CORPORATION
Reel/Frame 013700/0730 →
Assignment of Assignor's Interest
Jan 30, 2003
From: WELCH, DAVID F.; NAGARAJAN, RADHAKRISHNAN L.; KISH JR., FRED A.; MISSEY, MARK J.
To: INFINERA CORPORATION
Reel/Frame 013704/0657 →
Assignment of Assignor's Interest
Jan 30, 2003
From: WELCH, DAVID F.; DOMINIC, VINCENT G.; KISH, FRED A., JR.; MISSEY, MARK J.
To: INFINERA CORPORATION
Reel/Frame 013716/0096 →
Assignment of Assignor's Interest
Jan 30, 2003
From: GRUBB, STEPHEN G.; MITCHELL, MATTHEW L.; TAYLOR, ROBERT B.; DOMINIC, VINCENT G.
To: INFINERA CORPORATION
Reel/Frame 014153/0117 →
Assignment of Assignor's Interest
Jan 30, 2003
From: KISH JR., FRED A.; JOYNER, CHARLES H.; WELCH, DAVID F.; WEBJORN, JONAS
To: INFINERA CORPORATION
Reel/Frame 013704/0695 →
Assignment of Assignor's Interest
Jan 30, 2003
From: SINGH, JAGDEEP; PERKINS, DREW D.; WELCH, DAVID F.; YIN, MARK
To: INFINERA CORPORATION
Reel/Frame 014169/0051 →
Assignment of Assignor's Interest
Apr 8, 2003
From: GRENCAVICH, ROBERT; NGUYEN, VINH D.; PAVINSKI JR., DONALD J.
To: INFINERA CORPORATION
Reel/Frame 013930/0122 →
Assignment of Assignor's Interest
Apr 8, 2003
From: WELCH, DAVID F.; DOMINIC, VINCENT G.; KISH JR., FRED A.; MISSEY, MARK J.
To: INFINERA CORPORATION
Reel/Frame 013930/0162 →
Assignment of Assignor's Interest
May 6, 2003
From: NAGARAJAN, RADHAKRISHNAN L.; DENTAI, ANDREW; KISH, FRED G.
To: INFINERA CORPORATION
Reel/Frame 014040/0510 →
Assignment of Assignor's Interest
May 6, 2003
From: KISH, JR., FRED A.; MATHIS, SHEILA K.; JOYNER, CHARLES H.; SCHNEIDER, RICHARD P.
To: INFINERA CORPORATION
Reel/Frame 014031/0721 →
Assignment of Assignor's Interest
Jun 25, 2003
From: JOYNER, CHARLES H.; MISSEY, MARK J.; NAGARAJAN, RADHAKRISHNAN L.; PETERS, FRANK H.
To: INFINERA CORPORATION
Reel/Frame 014202/0527 →
Assignment of Assignor's Interest
Nov 12, 2003
From: PERKINS, DREW D.; JARCHI, MICHAEL D.; SRIDHARAN, SATISH K.
To: INFINERA CORPORATION
Reel/Frame 014707/0563 →
Assignment of Assignor's Interest
Jan 27, 2004
From: SINGH, JAGDEEP; PERKINS, DREW D.; WELCH, DAVID F.; YIN, MARK
To: INFINERA CORPORATION
Reel/Frame 014292/0918 →
Assignment/Relinquishment of Rights
Feb 9, 2004
From: KLEINER, PERKINS, CAUFIELD & BYERS; PER VINOD KHOSLA, PARTNER & PRINCIPAL
To: INFINERA CORPORATION
Reel/Frame 014320/0985 →
Assignment of Assignor's Interest
Mar 23, 2004
From: SINGH, JAGDEEP; PERKINS, DREW D.; WELCH, DAVID F.; YIN, MARK
To: INFINERA CORPORATION
Reel/Frame 014454/0280 →
Assignment of Assignor's Interest
Apr 29, 2005
From: GRUBB, STEPHEN G.
To: INFINERA CORPORATION
Reel/Frame 015963/0899 →
Intellectual Property Security Agreement
Jun 27, 2005
From: INFINERA CORPORATION
To: UNITED COMMERCIAL BANK
Reel/Frame 016182/0575 →