IP Library › Granted Patent US 7,037,002
Granted Patent B2
US 7,037,002 · App. 10/890,252 · Granted May 2, 2006

Optical component and method of manufacturing the same

Assignee: Matsushita Electric Industrial Co., Ltd.
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Quick Facts
Patent No.
US 7,037,002
App. No.
10/890,252
Granted
May 2, 2006
Kind
B2
Abstract

An optical component is provided for optical communication and has a smaller size and a shorter height. The optical component involves a concave package provided by layering ceramic substrates, a groove section formed at a bottom face of this package, an optical semiconductor element provided in this groove section, a cover provided to cover an opening section of the package and a lens formed at the cover.

Claims (50)

1. An optical component, comprising:

a concave package including layered ceramic substrates;

a groove section formed at a bottom face of the package;

an optical semiconductor element housed in the groove section;

a cover arranged to cover an opening section of the package;

a lens formed at the cover;

a fixed substrate housed in the package and fixing the optical semiconductor element to the groove section; and

a ball lens fixed to a window of the fixed substrate,

wherein the thickness of the fixed substrate can be changed depending on an optical path.

2. A method for manufacturing an optical component, wherein the optical component comprises:

a concave package,

a groove section formed at a bottom face of the package,

an optical semiconductor element housed in the groove section,

a cover for covering an opening section of the package,

a lens formed in the cover,

a fixed substrate that is housed in the package and that has a window, and

a ball lens fixed to the window of the fixed substrate,

wherein the method comprises:

adjusting a distance from the ball lens to the optical semiconductor element; and

wherein the distance is adjusted by controlling the thickness of the fixed substrate.

3. An optical component, comprising:

a concave package including layered ceramic substrates;

a groove section formed at a bottom face of the package;

an optical semiconductor element housed in the groove section;

a cover arranged to cover an opening section of the package;

a lens formed at the cover;

a fixed substrate housed in the package and fixing the optical semiconductor element to the groove section; and

a window having a shape that is smaller than an outer shape of the optical semiconductor element and that is larger than the size of a light-receiving section or a light-emitting section of the optical semiconductor element.

4. The optical component according to claims 3 , further comprising:

an electrode provided at a bottom face of the package;

an electrode of the optical semiconductor element; and

a wiring of the fixed substrate,

wherein the wiring of the fixed substrate connects the electrode of the optical semiconductor element to the electrode provided at a bottom face in the package.

5. The optical component according to claim 3 , further comprising:

interlayer wirings sandwiched by the layered ceramic substrates;

a through hole electrode formed in the ceramic substrates to connect the interlayer wirings to each other; and

an external electrode provided at least at an external side face or at a bottom face of the package,

wherein the interlayer wirings are connected to the external electrode.

6. The optical component according to claim 3 , wherein the groove section further includes two or more steps.

7. The optical component according to claim 3 , wherein the groove section has a shape that is similar to and larger than the shape of the optical semiconductor element.

8. The optical component according to claim 3 , wherein the light-receiving face or the light-emitting face of the optical semiconductor element is provided to be perpendicular to an optical axis of the lens.

9. The optical component according to claim 3 , wherein the lens is a diffractive lens.

10. The optical component according to claim 9 , wherein a diffraction pattern of the diffractive lens is formed at a face opposed to the optical semiconductor element.

11. The optical component according to claim 3 , further comprising a step formed at a face of the package having contact with the cover, wherein the step is engaged with the cover.

12. The optical component according to claim 3 , further comprising a step at a side face of the cover,

wherein the step is engaged with an opening section of the package.

13. The optical component according to claim 3 , wherein the difference in linear expansion coefficient between the package and the lens is 9×10 −7 K −1 or less.

14. The optical component according to claim 3 , wherein the lens is made of glass material that includes at least SiO 2 and B 2 O 3 and that includes at least either Na 2 O or K 2 O.

15. The optical component according to claim 3 , wherein the lens is made of fluorine crown glass including at least SiO 2 , B 2 O 3 and fluorine.

16. The optical component according to claim 3 , wherein the lens is made of fluorophosphate glass including P 2 O 5 and fluorine.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2004
From: TATEHATA, NAOKI; NISHIHARA, KAZUNARI; SASHINAKA, NOBUO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 015569/0898 →
Priority Claims (1)
JP 2003-198307 · Jul 17, 2003 · national
Continuity (1)
Related Publication 20050013562A1 · Jan 20, 2005