Ultrabarrier substrates
A barrier assembly. The barrier assembly includes at least one barrier stack having at least one barrier layer and at least one polymer layer. The barrier stack has an oxygen transmission rate of less than 0.005 cc/m 2 /day at 23° C. and 0% relative humidity, and an oxygen transmission rate of less than 0.005 cc/m 2 /day at 38° C. and 90% relative humidity. The barrier stack also has a water vapor transmission rate of less than 0.005 g/m 2 /day at 38° C. and 100% relative humidity. A method for making a barrier assembly is also disclosed.
1. A barrier assembly comprising:
at least one barrier stack comprising at least one barrier layer and at least one polymer layer, wherein the at least one barrier stack has an oxygen transmission rate of less than 0.005 cc/m 2 /day at 23° C. and 0% relative humidity.
2. The barrier assembly of claim 1 wherein the at least one barrier stack has an oxygen transmission rate of less than 0.005 cc/m 2 /day at 38° C. and 90% relative humidity.
3. The barrier assembly of claim 1 wherein the at least one barrier stack has a water vapor transmission rate of less than 0.005 g/m 2 /day at 38° C. and 100% relative humidity.
4. The barrier assembly of claim 1 further comprising a substrate adjacent to the at least one barrier stack.
5. The barrier assembly of claim 1 wherein the at least one barrier layer is substantially transparent.
6. The barrier assembly of claim 1 wherein at least one of the at least one barrier layer comprises a material selected from metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof.
7. The barrier assembly of claim 6 wherein the metal oxides are selected from silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof.
8. The barrier assembly of claim 6 wherein the metal nitrides are selected from aluminum nitride, silicon nitride, boron nitride, and combinations thereof.
9. The barrier assembly of claim 6 wherein the metal oxynitrides are selected from aluminum oxynitride, silicon oxynitride, boron oxynitride, and combinations thereof.
10. The barrier assembly of claim 1 wherein the at least one barrier layer is substantially opaque.
11. The barrier assembly of claim 1 wherein at least one of the at least one barrier layers is selected from opaque metals, opaque polymers, opaque ceramics, and opaque cermets.
12. The barrier assembly of claim 4 wherein the substrate comprises a flexible substrate material.
13. The barrier assembly of claim 12 wherein the flexible substrate material is selected from polymers, metals, paper, fabric, and combinations thereof.
14. The barrier assembly of claim 4 wherein the substrate comprises a rigid substrate material.
15. The barrier assembly of claim 14 wherein the rigid substrate material is selected from ceramics, metals, and semiconductors.
16. The barrier assembly of claim 1 wherein at least one of the at least one polymer layers comprises an acrylate-containing polymer.
17. The barrier assembly of claim 4 further comprising a polymer smoothing layer adjacent to the substrate.
18. The barrier assembly of claim 4 further comprising a scratch resistant layer adjacent to the substrate.
19. The barrier assembly of claim 4 further comprising an anti-reflective coating adjacent to the substrate.
20. The barrier assembly of claim 4 further comprising an anti-fingerprint coating adjacent to the substrate.
21. The barrier assembly of claim 4 further comprising an anti-static coating adjacent to the substrate.
22. The barrier assembly of claim 1 wherein the at least one barrier layer comprises two barrier layers.
23. The barrier assembly of claim 22 wherein the two barrier layers are made of the same barrier material.
24. The barrier assembly of claim 22 wherein the two barrier layers are made of different barrier materials.
25. The barrier assembly of claim 11 wherein at least one of the at least one barrier layers is opaque cermet selected from zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, niobium nitride, tungsten disilicide, titanium diboride, and zirconium diboride.