Apparatus for deforming resilient contact structures on semiconductor components
View Patent ↗A method for testing and burning-in semiconductor components such as semiconductor dice on a semiconductor wafer, is provided. The method includes the step of providing all of the components on the wafer with resilient contact structures, such as metal pins having integral spring segments. The resilient contact structures are used to test the components to identify functional and non-functional components. Following this test, the resilient contact structures on the non-functional components are deformed, such that electrical communication with the non-functional components is prevented in a subsequent burn-in test. This permits the burn-in test to be performed using “shared resources” test equipment. A deformation apparatus for deforming the resilient contact structures includes a deformation block configured to compress, bend or shape the resilient contact structures on the non-functional dice.
1. A method for planarizing resilient contact structures on a semiconductor component comprising:
providing a deformation apparatus configured to physically engage the resilient contact structures;
physically engaging the resilient contact structures using the deformation apparatus; and
following the physically engaging step, moving the deformation apparatus or the component, or both the deformation apparatus and the component, in X, Y and Z directions to bend, compress or shape the resilient contact structures.
2. The method of claim 1 wherein the deformation apparatus is configured to electrically engage the resilient contact structures for transmitting test signals to the component.
3. The method of claim 1 wherein the deformation apparatus comprises a deformation block comprising a plurality of retention structures configured to retain the resilient contact structures during the moving step.
4. The method of claim 1 wherein the deformation apparatus comprises a deformation block comprising a plurality of retention structures comprising pockets, grooves or a rough surface.
5. An apparatus for deforming resilient contact structures on a semiconductor component contained on a substrate comprising:
a deformation block comprising a plurality of retention structures configured to compress, bend or shape the resilient contact structures;
a first holder configured to hold and move the deformation block to compress, bend or shape the resilient contact structures; and
a second holder configured to hold the substrate proximate to the deformation block,
the first holder, the second holder, or both the first holder and the second holder, movable in X, Y and Z directions.
6. The apparatus of claim 5 wherein the deformation block further comprises a plurality of retention structures configured to retain the resilient contact structures during compression, bending or shaping thereof.
7. The apparatus of claim 5 wherein the deformation apparatus further comprises a plurality of retention structures configured to electrically engage the resilient contact structures and to transmit test signals thereto.
8. An apparatus for deforming resilient contact structures on a semiconductor component contained on a substrate comprising:
a deformation block comprising a plurality of retention structures configured to compress, bend or shape the resilient contact structures;
a first holder configured to hold and move the deformation block to compress, bend or shape the resilient contact structures; and
a second holder configured to hold the substrate proximate to the deformation block,
wherein the substrate comprises a semiconductor wafer and the component comprises a semiconductor die.
9. An apparatus for deforming resilient contact structures on a semiconductor component contained on a substrate comprising:
a deformation block comprising a plurality of retention structures configured to compress, bend or shape the resilient contact structures;
a first holder movable in X, Y and Z directions configured to hold and move the deformation block to compress, bend or shape the resilient contact structures; and
a second holder configured to hold the substrate proximate to the deformation block.
10. An apparatus for deforming resilient contact structures on a semiconductor component contained on a substrate comprising:
a deformation block comprising a plurality of retention structures configured to compress, bend or shape the resilient contact structures;
a first holder configured to hold and move the deformation block to compress, bend or shape the resilient contact structures; and
a second holder movable in X, Y and Z directions configured to hold the substrate proximate to the deformation block.
11. The apparatus of claim 10 wherein the retention structures are configured to planarize the resilient contact structures.
12. An apparatus for deforming resilient contact structures on a semiconductor die on a wafer comprising:
a deformation block comprising a plurality of retention structures configured to physically engage and retain the resilient contact structures;
a first holder configured to hold the deformation block; and
a second holder configured to hold the wafer proximate to the deformation block;
with either the first holder, the second holder, or both, movable in X, Y and Z directions such that the deformation block can compress, bend or shape the resilient contact structures.
13. The apparatus of claim 12 wherein the retention structures comprise openings in the deformation block.
14. The apparatus of claim 12 wherein the retention structures comprise a rough surface on the deformation block.
15. The apparatus of claim 12 further comprising a controller configured to control movement of the first holder or the second holder.
16. The apparatus of claim 12 wherein the retention structures comprise contact structures configured to electrically engage the resilient contact structures.