Etching with electrostatically attracted ions

1. A method of etching, comprising

directing a single plasma etch having at least first and second gasses at a substrate, wherein the substrate is at least partially covered with at least first and second layers, wherein the first gas at least includes tricholorborane (BCl 3 ) and the second gas includes sulfur hexafluoride (SF 6 );

electrostatically attracting ions of the first gas towards the substrate, wherein the second gas selectively etches the first layer relative to the second layer at an etch rate, wherein the first layer comprises silicon and the second layer comprises an electrically conductive material; and

detecting a drop in the etch rate by optical-emission spectroscopy to stop the etching when the second layer is exposed.

2. The method of etching of claim 1 , further comprising grounding the substrate.

3. The method of etching of claim 1 , further comprising applying an electrical bias to the substrate.

4. The method of etching of claim 1 , further comprising:

metallizing an aperture formed in the first layer by the etching to form a metal via that extends down to the second layer and wherein the silicon is a sacrificial silicon that is removed following the formation of the metal via that electrically contacts the metal layer.

5. The method of etching of claim 1 , wherein the electrostatically attracting ions of the first gas towards the substrate provides for etch directionality.

6. A method of making a micro-mirror device, comprising:

directing a single plasma etch having at least first and second gasses at a substrate having at least a first layer and a second layer, wherein the first gas at least includes tricholorborane (BCl 3 ) and the second gas is sulfur hexafluoride (SF 6 ); and

etching the silicon layer by electrostatically attracting ions of the first gas into the first layer towards the substrate, wherein the second gas selectively etches the first layer relative to the second layer at an etch rate, wherein the second layer comprises an electrically conductive material, and wherein the first layer is a sacrificial layer of silicon that is removed following the formation of the metal via that electrically contacts the second layer;

detecting a drop in the etch rate by optical-emission spectroscopy to stop the etching when the second layer is exposed;

metallizing the first layer to form a metal via in an aperture formed during the etching that extends through the first layer and is connected to the second layer; and

forming a reflective plate that is physically attached to the metal via, wherein the metal via physically connects and electrically couples the second layer and the reflective plate.

7. The method of etching of claim 6 , further comprising grounding the substrate.

8. The method of etching of claim 6 , further comprising applying an electrical bias to the substrate.

9. The method of etching of claim 6 , wherein the electrostatically attracting ions of the first gas towards the substrate provides for etch directionality.