Circuit device

1. A circuit device having:

a plurality of semiconductor elements;

first leads connected to bonding pads of the semiconductor elements and forming external terminals by extending outside of a package; and

second leads electrically interconnecting the semiconductor elements inside the package,

wherein both ends of the second leads are exposed outside of the package.

2. The circuit device of claim 1 , wherein the second leads extend parallel with a direction of alignment of the plurality of semiconductor elements.

3. A circuit device having:

a first semiconductor element and a second semiconductor element;

first leads electrically connected to the first semiconductor element or to the second semiconductor element via fine metal wires and having an end thereof extending outwardly;

second leads electrically connected to both the first semiconductor element and the second semiconductor element via fine metal wires for electrically connecting the first semiconductor element and the second semiconductor element,

wherein both ends of the second leads are exposed outside of a package.

4. The circuit device of claim 3 , wherein the fine metal wires are connected to the second leads so as to extend over an upper portion of at least one of the first leads or the second leads.

5. The circuit device of claim 3 , wherein the second leads extend parallel with the direction of alignment of the first semiconductor element and second semiconductor element.

6. The circuit device of claim 3 , wherein the second leads at locations where second leads are connected to the fine metal wires are formed to be wider than at other locations.

7. The circuit device of claim 3 , wherein portions project upwardly from the second leads at locations where the second leads are connected to the fine metal wires.

8. The circuit device of claim 7 , wherein each portion comprises an inclined portion extending obliquely upward from the second leads and a planar portion extending from the inclined portion.

9. A circuit device having:

a first circuit element;

first leads electrically connected to the first circuit element via first fine metal wires and having an end thereof extending outwardly;

second leads connected to the first leads via second fine metal wires;

a second circuit element electrically connected to the second leads,

wherein both ends of the second leads are exposed outside of a package.

10. The circuit device of claim 9 , wherein the first fine metal wires or the second fine metal wires extend over an upper portion of at least one of the first leads or second leads.

11. The circuit device of claim 9 , wherein the first leads or the second leads at locations where the first fine metal wires or the second metal wires are connected are formed to be wider than at other locations.

12. The circuit device of claim 9 , wherein prominent portions projecting upward are provided in the first leads or second leads at locations where the first fine metal wires or the second fine metal wires are connected.

13. The circuit device of claim 12 , wherein each prominent portion includes an inclined portion extending obliquely upward from the second leads and a planar portion extending from the inclined portion.

14. A circuit device having an island, first leads having external leads formed by providing an end thereof in a periphery of the island via inner leads and projecting another end thereof from a sealing resin and a semiconductor element disposed on the island, comprising:

wiring leads extending from one region on one side of a package formed of the sealing resin inside the package and from the inside of the package to another region on the one side of the package, wherein

the semiconductor element is sealed inside the package and is electrically connected to a separate circuit element via the wiring leads,

wherein both ends of the wiring leads are exposed outside of the package.

15. The circuit device of claim 14 , wherein the separate circuit element is a semiconductor element or a passive element.

16. The circuit device of claim 14 , wherein a plurality of semiconductor chips are stacked on the island.

17. A circuit device having a plurality of islands, first leads having external leads formed by providing an end thereof in a periphery of the plurality of islands via inner leads and projecting another end thereof from a sealing resin and a plurality of semiconductor elements disposed on the plurality of islands respectively, comprising

wiring leads extending from one region on one side of a package formed of the sealing resin to a vicinity of the plurality of islands and from the vicinity of the plurality of islands to another region on the one side of the package, wherein

the plurality of semiconductor elements are sealed inside the package and are electrically interconnected via the wiring leads,

wherein both ends of the wiring leads are exposed outside of the package.