Patent Assignment
Reel/Frame 033713/0296
Assignment of Assignor's Interest
Recorded: 2014-09-10
Pages: 9
Assignor
KANTO SANYO SEMICONDUCTOR CO., LTD.
Executed: 2014-09-10
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Properties
(42)
Semiconductor Device with Exposed Electrodes
Method for Manufacturing Circuit Devices
Method for Manufacturing Circuit Devices
Method for Manufacturing Circuit Devices
Circuit Device Manufacturing Method
Circuit Device Manufacturing Method Including Mounting Circuit Elements on a Conductive Foil, Forming Separation Grooves in the Foil, and Etching the Rear of the Foil
Semiconductor Device, Method for Manufacturing Same and Thin Plate Interconnect Line Member
Circuit Device and Method of Manufacture Thereof
Circuit Device and Method of Manufacture Thereof
Circuit Device with Conductive Patterns Separated by Insulating Resin-Filled Grooves
Circuit Device and Method for Manufacturing the Same
Semiconductor Device with a Resin-Sealed Optical Semiconductor Element
Resin Sealing-Type Semiconductor Device and Method for Manufacturing the Same
Method for Manufacturing Mounting Substrate and Method for Manufacturing Circuit Device
Method of Manufacturing Semiconductor Device
Semiconductor Device and Switching Element
Semiconductor Device and Hybrid Integrated Circuit Device
Cutting Method and Method of Manufacturing Semiconductor Device
Semiconductor Device Including Inclined Cut Surface and Manufacturing Method Thereof
Circuit Device
Method of Manufacturing Hybrid Integrated Circuit Device
Hybrid Integrated Circuit Device and Method of Manufacturing the Same
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Circuit Device
Semiconductor Device and Manufacturing Method of the Same
Semiconductor Device
Semiconductor Device and Manufacturing Method of the Same
Circuit Device Manufacturing Method
Semiconductor Device with a Peeling Prevention Layer
Semiconductor Device with a via Hole Having a Diameter at the Surface Larger Than a Width of a Pad Electrode
Semiconductor Device and Manufacturing Method of the Same
Semiconductor Device with Penetrating Electrode
Chucking Method and Processing Method Using the Same
Semiconductor Device with a Substrate Having a Spiral Shaped Coil
Semiconductor Apparatus
Semiconductor Device and Method of Manufacturing the Same
Circuit Device and Method of Manufacturing the Same
Optical Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Manufacturing Method of the Same
Method of Manufacturing a Semiconductor Device with a Peeling Prevention Layer
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 23, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 032027/0012 →
Corrective Assignment to Correct the Incorrect #12/577882 Previously Recorded on Reel 026594 Frame 0385. Assignor(S) Hereby Confirms the Assignment.
May 6, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 032836/0342 →
Assignment of Assignor's Interest
Sep 4, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033670/0750 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Assignment of Assignor's Interest
Oct 17, 2018
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047886/0162 →
Security Interest
Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →