To provide a circuit device suitable for incorporating a semiconductor element emitting or receiving short-wavelength light. The circuit device includes a casing, a semiconductor element, and a cover portion. The casing has an opening on the top face thereof. The semiconductor element is incorporated in the casing and emits or receives light. The cover portion is made of a material transparent to the light and covers the opening. In the periphery of the opening, a concave portion is provided, and a portion of the cover portion with a certain thickness on the bottom side is accommodated in the concave portion. Since the portion of the cover portion with the certain thickness on the bottom side is accommodated in the concave portion provided in the upper portion of the casing, the position of the cover portion is accurately fixed. Accordingly, it is possible to obtain accurate relative positions of the semiconductor element accommodated within the casing and the cover portion.
1. A circuit device, comprising:
a casing;
a semiconductor element arranged in a bottom portion of the casing;
a communication portion which is provided in a portion of the bottom portion corresponding to an arrangement area of the semiconductor element and which allows the inside of the casing to communicate with the outside, and
a lead electrically connected to the semiconductor element and exposed to the outside of the casing,
wherein an internal space of the casing is in direct communication with the outside of the casing via the communication portion.
2. The circuit device according to claim 1 , wherein
the semiconductor element is fixed to the bottom portion through a die attach sheet.
3. The circuit device according to claim 1 , wherein
the communication portion includes:
a plurality of groove portions continuously provided to edges of the arrangement area; and
a communication hole provided by penetrating the groove portions.
4. The circuit device according to claim 3 , wherein
the plurality of groove portions are provided to cross each other, and the communication hole is provided at a place where the groove portions cross each other.
5. The circuit device according to claim 3 , wherein
one groove portion is provided, and the communication hole is provided in the middle of the groove portion.
6. The circuit device according to claim 1 , wherein
the communication portion is formed to protrude from an area where the semiconductor element is placed.
7. The circuit device according to claim 1 , wherein the casing encloses the internal space and the communication portion is a volume which enables the internal space to be in gas flow communication with the outside of the casing.
8. A circuit device, comprising:
a casing which is composed of a bottom portion and a side portion and includes an opening in an upper portion;
a semiconductor element which is fixed to the bottom portion and includes one of a light emitting portion and a light receiving portion on a surface thereof;
leads buried in the bottom portion and arranged with one end close to the semiconductor element;
a thin metal wire connecting the semiconductor element and one of the leads;
a cover portion made of a material transparent to one of light emitted by the light emitting portion and light received by the light receiving portion, the cover portion covering the opening; and
a communication portion which is provided in a portion of the bottom portion corresponding to an arrangement area of the semiconductor element and which allows the inside of the casing to communicate with the outside thereof,
wherein an internal space of the casing is in direct communication with the outside of the casing via the communication portion.
9. The circuit device according to claim 8 , wherein
the semiconductor element is fixed to the bottom portion through a die attach sheet.
10. The circuit device according to claim 8 , wherein
the communication portion includes:
groove portions continuously provided to edges of the arrangement area; and
a communication hole penetrating the groove portions.
11. The circuit device according to claim 10 , wherein
the plurality of groove portions are provided to cross each other, and the communication hole is provided at a place where the groove portions cross each other.
12. The circuit device according to claim 10 , wherein
one groove portion is provided, and the communication hole is provided in the middle of the groove portion.
13. The circuit device according to claim 8 , wherein
the communication portion is formed to protrude from an area where the semiconductor element is placed.
14. A circuit device, comprising:
a casing enclosing an internal space and having a bottom portion;
a semiconductor element arranged in the a bottom portion of the casing;
a communication volume, which is provided in a portion of the bottom portion corresponding to an arrangement area of the semiconductor element and which enables the internal space to be in gas flow communication with an outside of the casing, and
a lead electrically connected to the semiconductor element and exposed to the outside of the casing.