Semiconductor device and hybrid integrated circuit device
View Patent ↗The related arts have difficulty in efficiently dissipating the heat generated by a resin-molded semiconductor element, and thus have the problem of thermal stress causing damage to the semiconductor element. To solve the problem, a semiconductor device of the preferred embodiments includes common leads coupled to an island, and a part of the common leads projects out from a resin seal body. The projecting common leads have a coupling portion. When mounting the semiconductor device, the common leads are bridged with brazing material. Thus, the heat generated by an integrated circuit chip mounted on the island is dissipated through the common leads to the outside of the resin seal body. In the preferred embodiments of the invention, a further improvement in heat dissipation characteristics can be accomplished by increasing the surface areas of the common leads.
1. A semiconductor device including:
an island on which a semiconductor element is mounted;
a plurality of discrete leads each having an end extending near the island;
a plurality of common leads coupled to the island; and
a resin-sealing body molding the semiconductor element, the island, the discrete leads, and the common leads,
wherein the common leads projecting out from the resin-sealing body are provided with a coupling portion.
2. The semiconductor device according to claim 1 , wherein the common leads are bonded to a conductive pattern with a conductive adhesive, and the common leads are bridged with the conductive adhesive between the coupling portion and the conductive pattern.
3. The semiconductor device according to claim 1 , wherein the common leads are coupled to both sides of the island.
4. The semiconductor device according to claim 1 , wherein the common leads are each formed into a gull-wing shape.
5. A hybrid integrated circuit device including:
a conductive pattern formed at least on a surface of a hybrid integrated circuit board;
a semiconductor element or a passive element mounted on the conductive pattern;
a plurality of leads connected to the conductive pattern and extending outside, the leads acting as an output or an input; and
a resin-sealing body made of a thermosetting resin, which coats at least the surface of the board by transfer molding,
wherein the leads have a plurality of common leads projecting out from the resin-sealing body, and the common leads are coupled by a coupling portion.
6. The hybrid integrated circuit device according to claim 5 , wherein the common leads are bonded to a conductive pattern with a conductive adhesive, and the common leads are bridged with the conductive adhesive between the coupling portion and the conductive pattern.
7. The hybrid integrated circuit device according to claim 5 , wherein the common leads are each formed into a gull-wing shape.
8. The hybrid integrated circuit device according to claim 5 , wherein the board is made of a metal board, and has a die-cut surface which is opposite to the surface of the board on which the conductive pattern is formed, and the die-cut surface is located on a side of a rear surface of the resin-sealing body.
9. The semiconductor device according to claim 1 , wherein the coupling portion is formed between a side surface of the resin-sealing body and ends of the common leads.
10. The semiconductor device according to claim 4 , wherein the coupling portion is formed on a vertical portion of the gull-wing shape.
11. The hybrid integrated circuit device according to claim 5 , wherein the coupling portion is formed between a side surface of the resin-sealing body and ends of the common leads.
12. The hybrid integrated circuit device according to claim 7 , wherein the coupling portion is formed on a vertical portion of the gull-wing shape.