Method of manufacturing hybrid integrated circuit device

1. A method of manufacturing a hybrid integrated circuit device comprising:

forming a plurality of units each including a conductive pattern on a front surface of a board;

electrically connecting circuit elements to the conductive patterns in the respective units;

separating respective circuit boards by dividing the board along boundaries of the units; and

flattening side surfaces of the circuit boards by pressing the side surfaces.

2. A method of manufacturing a hybrid integrated circuit device comprising:

forming a plurality of units each including a conductive pattern on a surface of a board made of metal;

forming grooves along boundaries of the respective units of the board;

electrically connecting circuit elements to the conductive patterns in the respective units;

separating respective circuit boards by dividing the board along the grooves; and

flattening side surfaces of the circuit boards by pressing the side surfaces.

3. The method of manufacturing a hybrid integrated circuit device according to claim 2 ,

wherein the grooves include:

a first groove formed on the front surface of the board; and

a second groove formed on a back surface of the board.

4. The method of manufacturing a hybrid integrated circuit device according to claim 2 ,

wherein the board is separated by bending the board at a position of each of the grooves.

5. The method of manufacturing a hybrid integrated circuit device according to claim 4 ,

wherein the board is bent while supporting the board from both side surfaces of the board.

6. The method of manufacturing a hybrid integrated circuit device according to any one of claims 1 and 2 ,

wherein the plurality of units are formed in a matrix form.