Patent Assignment
Reel/Frame 033670/0750
Assignment of Assignor's Interest
Recorded: 2014-09-04
Pages: 4
Assignor
SANYO ELECTRIC CO., LTD
Executed: 2014-08-27
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD-A700, PHOENIX, ARIZONA, 85008
Covered Properties
(10)
Method for Manufacturing Circuit Devices
Method for Manufacturing Circuit Devices
Circuit Device Manufacturing Method
Circuit Device Manufacturing Method Including Mounting Circuit Elements on a Conductive Foil, Forming Separation Grooves in the Foil, and Etching the Rear of the Foil
Semiconductor Device, Method for Manufacturing Same and Thin Plate Interconnect Line Member
Circuit Device and Method of Manufacture Thereof
Circuit Device with Conductive Patterns Separated by Insulating Resin-Filled Grooves
Method for Manufacturing Mounting Substrate and Method for Manufacturing Circuit Device
Circuit Device Manufacturing Method
Circuit Substrate, Circuit Device and Manufacturing Process Thereof
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2014
From: KANTO SANYO SEMICONDUCTOR CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033713/0296 →
Assignment of Assignor's Interest
Sep 24, 2014
From: SANYO SEMICONDUCTOR CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033813/0420 →
Change of Name
Dec 3, 2014
From: SANYO SEMICONDUCTOR CO., LTD
To: SYSTEM SOLUTIONS CO., LTD.
Reel/Frame 034537/0044 →
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 033813 Frame: 0420. Assignor(S) Hereby Confirms the Assignment.
Jan 21, 2015
From: SYSTEM SOLUTIONS CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034816/0510 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →