Circuit device and method of manufacture thereof
View Patent ↗A circuit device 10 comprises conductive patterns 11 , separated by separation grooves 41 , circuit elements 12 , affixed onto conductive patterns 11 , and an insulating resin 13 , covering circuit elements 12 and conductive patterns 11 and filling separation grooves 41 while exposing the rear surfaces of conductive patterns 11 . Constricted parts 19 are formed at side surfaces of separation grooves 41 . At constricted parts 19 , the width of separation grooves 41 is made narrower than at other locations. Thus by making insulating resin 13 adhere closely to constricted parts 19 , the adhesion of insulating resin 13 with conductive patterns 11 is improved.
1. A circuit device comprising: conductive patterns separated by a separation groove; circuit elements, affixed onto the conductive patterns; and an insulating resin, covering the circuit elements and the conductive patterns and filling the separation groove while exposing the rear surfaces of the conductive patterns;
wherein a protrusion is formed continuously at every side surface of the conductive patterns and the insulating resin is adhered to every protrusion.
2. The device of claim 1 , wherein the thickness of the conductive patterns is made thicker than the width of the separation groove.
3. The device of claim 1 , wherein the rear surface and part of the side surface of the conductive patterns are exposed from the insulating resin.
4. The device of claim 1 wherein side surfaces of the conductive patterns are formed to a curved form.
5. The device of claim 1 wherein a depth of the separation groove is more than twice the width of the separation groove.
6. The device of claim 1 wherein the conductive patterns protrude outside the insulating resin.
7. A circuit device comprising: conductive patterns separated by a separation groove; a circuit element, affixed onto the conductive pattern; and an insulating resin, covering the circuit element and the conductive patterns and filling the separation groove while exposing the rear surfaces of the conductive patterns;
wherein an etched protrusion is formed continuously at every side surface of the conductive patterns and the insulating resin is adhered to every protrusion.
8. The device of claim 7 , wherein the thickness of the conductive patterns is made thicker than the width of the separation groove.
9. The device of claim 7 , wherein the rear surface and part of the side surface of the conductive patterns are exposed from the insulating resin. insulating resin.
10. The device of claim 7 wherein side surfaces of the conductive pattern are formed to a curved form.
11. The device of claim 7 wherein a depth of the separation groove is more than twice the width of the separation groove.
12. The device of claim 7 wherein the conductive patters protrude outside the insulating resin.