Circuit substrate, circuit device and manufacturing process thereof
View Patent ↗A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.
1. A circuit substrate comprising:
a metal substrate comprising a top surface, a bottom surface, a first side surface and a second side surface;
an insulating layer covering the top surface of the metal substrate; and
a conductive pattern formed on the insulating layer,
wherein the first side surface comprises a first inclining side surface inclining from the top surface and a second inclining side surface inclining from the bottom surface, and the first inclining side surface is shorter in a corresponding inclining direction thereof than the second inclining side surface in a corresponding inclining direction thereof, and
the second side surface comprises a third inclining side surface inclining from the top surface and a fourth inclining side surface inclining from the bottom surface, and the third inclining side surface is longer in a corresponding inclining direction thereof than the fourth inclining side surface in a corresponding inclining direction thereof.
2. The circuit substrate of claim 1 , further comprising a pad electrode formed on the insulating layer adjacent the first inclining side surface so that no other part of the conductive pattern is disposed between the pad electrode and the first inclining side surface.
3. The circuit substrate of claim 1 , further comprising a circuit element disposed on the insulating layer and connected to the conductive pattern.
4. The circuit substrate of claim 2 , further comprising a lead attached to the pad electrode.
5. The circuit substrate of claim 3 , further comprising a sealing resin covering the circuit element and the insulating layer.
6. A circuit substrate comprising:
a metal substrate comprising a top surface, a bottom surface, a first side surface and a second side surface;
an insulating layer covering the top surface of the metal substrate; and
a conductive pattern formed on the insulating layer,
wherein the first side surface comprises a first inclining side surface inclining from the top surface, the second side surface comprises a second inclining side surface inclining from the top surface, and the first inclining side surface is shorter in a corresponding inclining direction thereof than the second inclining side surface in a corresponding inclining direction thereof.
7. The circuit substrate of claim 6 , wherein the first side surface comprises a third inclining side surface inclining from the bottom surface, the second side surface comprises a fourth inclining side surface inclining from the bottom surface, and the third inclining side surface is longer in a corresponding inclining direction thereof than the fourth inclining side surface in a corresponding inclining direction thereof.
8. The circuit substrate of claim 6 , further comprising a circuit element disposed on the insulating layer and connected to the conductive pattern.
9. The circuit substrate of claim 8 , wherein the circuit element comprises a light emitting element.
10. The circuit substrate of claim 9 , further comprising a sealing resin covering the light emitting element and the insulating layer.
11. A circuit substrate comprising:
a metal substrate comprising a top surface, a bottom surface, a first side surface, a second side surface opposite from the first side surface, a third side surface and a fourth side surface opposite from the third side surface;
an insulating layer covering the top surface of the metal substrate; and
a conductive pattern formed on the insulating layer,
wherein the first side surface comprises a first inclining side surface inclining from the top surface, the second side surface comprises a second inclining side surface inclining from the top surface, the third side surface comprises a third inclining side surface inclining from the top surface, the fourth side surface comprises a fourth inclining side surface inclining from the top surface, and the first and second inclining side surfaces are shorter in corresponding inclining directions thereof than the third and fourth inclining side surfaces in corresponding inclining directions thereof.
12. The circuit substrate of claim 11 , wherein the first side surface comprises a fifth inclining side surface inclining from the bottom surface, the second side surface comprises a sixth inclining side surface inclining from the bottom surface, the third side surface comprises a seventh inclining side surface inclining from the bottom surface, the fourth side surface comprises a eight inclining side surface inclining from the bottom surface, and the fifth and sixth inclining side surfaces are longer in corresponding inclining directions thereof than the seventh and eighth inclining side surfaces in corresponding inclining directions thereof.
13. A semiconductor device comprising:
a metal substrate comprising a top surface, a bottom surface and four side surfaces, the top surface being insulated;
a conductive pattern insulated from the metal substrate; and
a semiconductor element mounted on and electrically connected to the conductive pattern, wherein each of the side surfaces of the metal substrate comprises a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate; and
the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.
14. The semiconductor device of claim 13 , wherein the metal substrate and the semiconductor element are covered with a sealing resin, and an input-output pad that is part of the conductive pattern is provided at least on one of the two opposing side surfaces of the pair.
15. The semiconductor device of claim 14 , wherein the pad is provided in plurality on at least one of the two opposing side surfaces of the particular pair
wherein the metal substrate and the semiconductor element are covered with a sealing resin, and a plurality of input-output pads that are part of the conductive pattern are provided at least on one of the two opposing side surfaces of the pair.
16. The semiconductor device of claim 13 , wherein the semiconductor element comprises an LED or a switching element that is used for an inverter circuit.
17. The circuit substrate of claim 6 , wherein the metal substrate is elongated in a direction, and a plurality of light emitting elements are disposed on the metal substrate so as to align in the direction of elongation of the metal substrate.
18. The circuit substrate of claim 17 , wherein the light emitting elements are connected serially.
19. The circuit substrate of claim 11 , wherein the metal substrate is elongated in a direction, and a plurality of light emitting elements are disposed on the metal substrate so as to align in the direction of elongation of the metal substrate.
20. The circuit substrate of claim 19 , wherein the light emitting elements are connected serially.
21. The semiconductor device of claim 13 , wherein the metal substrate is elongated in a direction, and a plurality of light emitting elements are disposed on the metal substrate so as to align in the direction of elongation of the metal substrate.
22. The semiconductor device of claim 21 , wherein the light emitting elements are connected serially.